Electronics Forum | Sun May 24 21:12:59 EDT 2009 | keith78
I have a problem recently to qualify QFN package on solder joint reliability. The pcb thickness stated in IPC-9701 is 2.35mm but from the in-house test, QFN surface mount on 2.35mm thickness PCB board have a short cycle to failure due to higher CTE m
Electronics Forum | Sat Nov 03 09:29:17 EDT 2007 | davef
IPC-9701, SMT Solder Joint Reliability Qualification and Performance Standard is an update of D-279, Design Guidelines For Reliable SMT PCA that includes BGA and PbFree
Electronics Forum | Tue Feb 03 09:36:05 EST 2004 | davef
Unfortunately, IPC-D-279, IPC-TM-650, IPC-TR-464, and MIL-STD-810 will not answer your questions, because they do NOT address LF-solders. Even the tests in IPC-9701 need to be modified for LF-solders, because: * LF-solder has different creep behavior
Electronics Forum | Wed Nov 28 22:33:24 EST 2007 | davef
There is no specification for lead-free HASL. You can use any lead-free solderability protection that meets your customer requirements. Use IPC-9701 �Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments� to ass
Electronics Forum | Tue Apr 09 08:49:43 EDT 2002 | davef
Hey Bud. Allow me to 'turn' your point about 'grain structure' just a bit. Fast cooling rates / coarse grain structures was a bit of red herring in the early 80's. Faster cooling DOES produce finer grained solder connections. Accelerated testing of
Electronics Forum | Tue Aug 07 20:43:47 EDT 2001 | davef
First, we know that MIL types are wont to use charts like that. Give �em Weibull distribution tables and then they�ll be happy, happy. A good book is Nelson �Accelerated Testing: Statistical Models �� Wiley Second, we don�t use that very nice stu
| 1 |
