Electronics Forum | Fri Mar 12 12:59:50 EST 2004 | babe
Sorry for the late reply, I am an ersa dealer may I suggest mounting an alternative thermocouple attached to a DMM in close proximity to the BGA. See what the differences are in your readings from the DMM and the Digital temp reading on the IR550A. I
Electronics Forum | Mon Nov 25 07:47:15 EST 2002 | Yannick
And what about the one from Ersa the IR550A?? It's more that 20k but did someone tried it?
Electronics Forum | Wed Jul 30 00:05:05 EDT 2003 | praveen
Hi, I am observing warpage in the PBGA during reflow in rework machine.Reflow profile is std. (Peak temp is 214 deg C using 63/37 paste). Please advise what should be the gap between the nozzle and the BGA body during reflow process in SRT BGA rework
Electronics Forum | Thu Jul 31 09:03:36 EDT 2003 | russ
Are you baking the parts prior to installation? I have found that this will help in some cases. Russ
Electronics Forum | Thu Jul 31 12:08:12 EDT 2003 | Kris
Hi, Are you printing the paste uniformly ?
Electronics Forum | Thu Jul 31 21:22:57 EDT 2003 | praveen
Yes the paste printing is uniform. I have not tried out paste flux yet.
Electronics Forum | Wed Jul 30 23:16:01 EDT 2003 | praveen
The profile is enclosed.The PBGA is 37x37 mm.I am keeping the gap about 4-5 mm.The profile meets the solder paste spec.Peak temp is 211 deg C,Above melting point 77 sec. rate of heating
Electronics Forum | Thu Jul 31 21:21:54 EDT 2003 | praveen
Yes we are baking the boards and the BGA. Using a CDM material pallet to hold the PCB as clamping is a problem without that.
Electronics Forum | Thu Jul 31 15:29:25 EDT 2003 | bcceng
A couple of things you can look into 1. The proper bottom pre-heat of board. If you are applying only direct hot air to BGA without preheating can cause BGA's to warp and collapse un-even. 2. Moisture on you BGA's. If BGA's were not properly packa
Electronics Forum | Mon Aug 04 17:35:08 EDT 2003 | Dean
If you lay a flat edge on the PBGA, it is visibly warped? How much of a warp? 0.001, 0.010, 0.050 what? What is your pcb temperature just prior to entering the spike process (zone or step or what ever you call it)? Is it between 165 and 175 C?
