Electronics Forum | Wed Jun 09 23:48:38 EDT 1999 | dEAN
| I am interested in seeing how some of you quote smt work. Currently we quote off a bom without component packages known then look in data books to find out what type of component they are. This job will be mine soon but i really believe there is a
Electronics Forum | Wed Apr 10 06:03:14 EDT 2002 | capfelix
Does anyone heard of stain-shield term? It's related to screen process but not sure what's its exact meaning. Is it necessary in a SMT process? Thanks!
Electronics Forum | Mon Jul 20 15:11:34 EDT 1998 | Scott McKee
| QFP's are best left the professionals. There are MANY subtle issues with fine pitch lead forming such as critical tool design issues ability to check critical dimensions etc. Unless you want to replow this grown in hopes of getting a promotion or
Electronics Forum | Tue Jul 06 08:48:11 EDT 2010 | Sean
Hi all, Is anyone used to encounter PTH(plated through hole) crystal component(Not SMT component) become malfunction when the environment humidity is more than 90%? It is happening here...It is very weird that crystal become OK when humidity is bac
Electronics Forum | Tue Feb 26 11:19:31 EST 2013 | anton99
Stephen, That's true and I am going to include the reflow time in our changeovers. That way if its taking to long to change the oven temperature it will show up in our metrics. I agree, if we miss a step in the changeover process our metrics will be
Electronics Forum | Wed Nov 16 21:25:33 EST 2022 | stephendo
I thought SMT was supposed to be replaced by the Occam Process by now?
Electronics Forum | Fri Nov 11 03:19:29 EST 2022 | angela t
There is a big difference between SMD and SMT. One term denotes a device and the other a process.SMD, or surface mount devices, are electronic resistors that sit on a printed circuit board (PCB).SMT, or surface mount technology, is a method of placin
Electronics Forum | Mon Apr 27 02:44:07 EDT 2009 | michafogel
Can someone point me to a standard, if there is any, or design rule regards with preffared spacing between PTH and SMT pads for LF wave soldering process (SAC alloy)
Electronics Forum | Thu Oct 02 15:34:08 EDT 2014 | arifa_anees
the data collected from a standard SMT process is typically very noisy due to the natural.Initially, the most common evaluation method was placement yield.Offset Placement After Solder Screen-printing can reduce or eliminate these defects through cor
Electronics Forum | Tue Jul 31 06:33:58 EDT 2001 | nifhail
What is the industry standard specification for Resisitivity monitoring at aqueous cleaning? What would be the diff. between specs. for normal PCBA vs PCB that has to go through wire bonding after SMT for COB process. pls advise..thx
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