Electronics Forum | Thu Sep 27 19:52:28 EDT 2001 | davef
All of the discussion of "environmental controls" are a matter of degree, dependent on the requirements of the product that you manufacture. For example: shops assembling under-the-hood products have different requirements than shops making garage d
Electronics Forum | Wed Mar 06 21:16:17 EST 2002 | davef
�What does 5 micrograms of chloride mean to me?� * With SIR testing, you can show no detrimental leakage currents under humid conditions, no corrosion, no metal migration, which are the big factors in figuring out electrochemical reliability. People
Electronics Forum | Thu Jul 18 13:11:56 EDT 2002 | gdstanton
Steve, We are touching up 6 - 12% of all solder joints processed. We consider the solder joint to be the focal point of the SMT process. Therefore our metric is based on it. For example in a given month we... 1. Assembled 25pcs of 'A' (IPC-A-610/J
Electronics Forum | Mon Dec 15 16:16:42 EST 2008 | davef
J-STD-001 requires that solderable surfaces of components and connectors be degolded prior to soldering. As proven methods for removal of the gold plating and replacing it with tin/lead, MIL-STD-2000 and J-STD-001 endorse[d] either: * Double dip (two
Electronics Forum | Thu Nov 29 17:30:07 EST 2001 | davef
You give no clue of what you want to write about. Let's try this: J-STD-001, 8.3.1 Particulate Matter says words to the effect of solder balls / splats shall be neither: * Loose or able to be dislodged during normal service � NOR * Violate minimu
Electronics Forum | Tue Jan 07 18:07:59 EST 2003 | davef
J-STD-001 prescribes acceptable temperature and humidity ranges for electronic assembly, but does not discuss required instrumentation, nor its accuracy nor coverage. We're unaware of another standard that requires such a thing. The standards of to
Electronics Forum | Tue Jun 29 14:42:55 EDT 2004 | davef
You're correct, for every dumpster full of paper written about solder, there's a sentance written about fluxes. There's dribs and drabs about fluxes in most of the soldering books [ie, Manko, Klein-Wassink, Judd, Strauss, etc] and most of that is ve
Electronics Forum | Mon Apr 10 22:32:14 EDT 2000 | Dave F
Mark: If you're looking for a baseline document for judging the acceptability of: * Mechanical assembly * Component installation * Soldering * Cleanliness * Marking * Coating * Laminate condition * Discrete wiring * Surface mounting of components .
Electronics Forum | Thu Mar 15 08:16:28 EST 2001 | davef
In a similar conversation ... Alex Krstic, NovAtel Inc. said ... Hello all. We recently received some boards with some of the chip resistors placed with their resistive elements towards the board. J-STD-001B and C view this as violation for both Cl
Electronics Forum | Tue Feb 22 05:50:40 EST 2000 | Arulvanan P
Hi, I am in the process of implemeting Through Hole Reflow. 1.I would to know which are the products/Companies that use that use this process. 2. Is there any reference / standard to convince my QA dept. to accept the boards even though there is no
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