Electronics Forum | Wed Jun 20 19:52:47 EDT 2007 | davef
J-STD-001, 5.4 Solderability Maintenance states words to the effect "The manufacturer shall ensure that all components [bla bla bla] are solderable at the start of hand and/or machine soldering operations." So, how many you contractor cats 'n kittie
Electronics Forum | Thu May 23 07:50:04 EDT 2013 | icin
The attached images appear to be a result of a touchup process. We believe that this is not a fracture, but more of a condition where the solder touchup process did not completely flow the solder. Is this acceptable per J-STD-001 and IPC-A-610 Class
Electronics Forum | Mon Jul 24 09:15:32 EDT 2017 | davef
James: This is not "breaking news." IPC-A-610F, Acceptability of Electronic Assemblies was released in July 2014. Both, ... * IPC-A-610G, Acceptability of Electronic Assemblies * J-STD-001G, Requirements for Soldered Electrical and Electronic Assem
Electronics Forum | Mon Apr 06 10:32:53 EDT 1998 | Justin Medernach
| Peter, | Take a look at IPC-ANSI J-STD-001A and B, J-STD-004 and I think, 005/006 which cover solder paste (?) I think. | Whatever, they do reference one another. | | Question: Whatparameters are used to determine "good" Solder Paste? What refer
Electronics Forum | Wed Dec 14 19:49:11 EST 2011 | joeherz
Been awhile.... We are in the process of determining where are gaps are for compliance to J-STD-001E and I have a question for those in the know. This section of the standard says the following: ----------- Electronic/mechanical components (includi
Electronics Forum | Sun Apr 05 19:02:34 EDT 1998 | Graham Naisbitt
Peter, Take a look at IPC-ANSI J-STD-001A and B, J-STD-004 and I think, 005/006 which cover solder paste (?) I think. Whatever, they do reference one another. | Question: Whatparameters are used to determine "good" Solder Paste? What reference doc
Electronics Forum | Wed Aug 06 20:50:42 EDT 2003 | davef
Well, if it "keeps coming up", let's take a pass at keeping down. For: * Requirement that gold be removed from components, pads, etc. is J-STD-001C, 5.4.1 * Context of that requirement [J-STD-001C, 5.4.1] and 6 or 7 references are in IPC-HDBK-001.
Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.
unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-
Electronics Forum | Mon Apr 16 09:12:23 EDT 2007 | davef
Standard for appearance: J-STD-001 and IPC-A-610 committees eliminated the requirement that solder connections be "bright and shiny". Certain solderability protections; such as Au, NiPd, NiPdAu; can affect the surface texture of a solder connection,
Electronics Forum | Thu Feb 05 18:16:37 EST 2009 | adamcrum
Can somebody help me to understand what standards are in place for deinozed water for cleaning circuit boards. I know they are supposed to be in acordance with J-STD-001D, but what does that entail? All I can find on the internet is that J-STD-001D a
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