Electronics Forum: j-std-001 (Page 3 of 27)

Opportunity

Electronics Forum | Wed Jun 20 19:52:47 EDT 2007 | davef

J-STD-001, 5.4 Solderability Maintenance states words to the effect "The manufacturer shall ensure that all components [bla bla bla] are solderable at the start of hand and/or machine soldering operations." So, how many you contractor cats 'n kittie

Solder Stations that meet J-STD-001 Rev E

Electronics Forum | Tue Nov 15 16:31:04 EST 2011 | pcbrown

Can anyone tell me if the Metcal SP200 solder station meets the J-STD-001 Rev E requirement of holding a tip temp of +/-9F at rest? I am in a fight with an auditor over this. These irons do not require calibration but I need to know if they meet J-ST

Acceptable per J-STD-001 and IPC-A-610 Class 3?

Electronics Forum | Thu May 23 07:50:04 EDT 2013 | icin

The attached images appear to be a result of a touchup process. We believe that this is not a fracture, but more of a condition where the solder touchup process did not completely flow the solder. Is this acceptable per J-STD-001 and IPC-A-610 Class

IPC-A-610 and IPC J-STD-001 Updations

Electronics Forum | Mon Jul 24 07:18:51 EDT 2017 | jamesbarnhart

IPC has updated assembly standards for IPC A-610 and IPC JSTD-001 making them easier to use and adding information in areas that have evolved. Both IPC J-STD-001E and IPC-A-610E have also been more closely linked to eliminating the differences that c

IPC-A-610 and IPC J-STD-001 Updations

Electronics Forum | Mon Jul 24 09:15:32 EDT 2017 | davef

James: This is not "breaking news." IPC-A-610F, Acceptability of Electronic Assemblies was released in July 2014. Both, ... * IPC-A-610G, Acceptability of Electronic Assemblies * J-STD-001G, Requirements for Soldered Electrical and Electronic Assem

SMT gold plated components

Electronics Forum | Wed Aug 06 20:50:42 EDT 2003 | davef

Well, if it "keeps coming up", let's take a pass at keeping down. For: * Requirement that gold be removed from components, pads, etc. is J-STD-001C, 5.4.1 * Context of that requirement [J-STD-001C, 5.4.1] and 6 or 7 references are in IPC-HDBK-001.

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.

unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-

solder SnPb wire to gold plated IC

Electronics Forum | Mon Apr 16 09:12:23 EDT 2007 | davef

Standard for appearance: J-STD-001 and IPC-A-610 committees eliminated the requirement that solder connections be "bright and shiny". Certain solderability protections; such as Au, NiPd, NiPdAu; can affect the surface texture of a solder connection,

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Wed Jul 18 10:35:41 EDT 2007 | hussman

This seems like an odd request from an auditor. I can see an auditor requiring proof that you meet the J-Std, but verify? This would require you purposely damage product on a "before and after" scenario. As long as your manufacturing guideline say

Deionized Water Standards

Electronics Forum | Thu Feb 05 18:16:37 EST 2009 | adamcrum

Can somebody help me to understand what standards are in place for deinozed water for cleaning circuit boards. I know they are supposed to be in acordance with J-STD-001D, but what does that entail? All I can find on the internet is that J-STD-001D a


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