Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef
Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to
Electronics Forum | Fri Jun 29 14:15:00 EDT 2001 | stefo
This is a question about complying with J-STD-001 solderability testing. Do any of you have your vendors certify that the components and PCB's that you buy from them comply with the solderabilty requirements spelled out in the -002 and -003, in lieu
Electronics Forum | Wed Jul 24 22:45:54 EDT 2002 | davef
WS609 is a wonderful paste. J-STD-001, 4.2 states words to the effect that for Class 3 products Type H or M fluxes should only be used for tinning operatins. Most water soluable fluxes are either H or M. I believe that you can use Type H or M flux
Electronics Forum | Mon Jul 16 15:44:27 EDT 2007 | davef
J-STD-001 doesn't necessarily require additional controls under conditions of low humidity, only that you verify the effectiveness of what you have in place. ESD S20.20 [1999] only says that relative humidity above 30% is "desirable". ESD S20.20 [200
Electronics Forum | Thu Aug 07 22:51:05 EDT 2008 | davef
We expect aerospace to be IPC-A-610, Class 3 and J-STD-001, Class 3. The above quality statement stecifies: * "IPC 610, Class 2 acceptability." This is unclear. Should this be "IPC-A-610, Class 2 acceptability?" * No class for J-STD-001. Should we a
Electronics Forum | Wed Dec 14 19:49:11 EST 2011 | joeherz
Been awhile.... We are in the process of determining where are gaps are for compliance to J-STD-001E and I have a question for those in the know. This section of the standard says the following: ----------- Electronic/mechanical components (includi
Electronics Forum | Tue Aug 13 23:22:50 EDT 2024 | simonattwood
3.4 says the solder paste shall meet requirements of 3.3 3.3 says the flux shall be L0 or L1 or if it is not you must have data demonstrating compatibility as per Appendix C. So if you wanted to use ORH0 solder paste, and be J-STD-001 compliant, yo
Electronics Forum | Wed Mar 06 21:16:17 EST 2002 | davef
�What does 5 micrograms of chloride mean to me?� * With SIR testing, you can show no detrimental leakage currents under humid conditions, no corrosion, no metal migration, which are the big factors in figuring out electrochemical reliability. People
Electronics Forum | Thu Jun 15 20:24:45 EDT 2000 | Jeff Tamagi
In section 7.3.2 of ANSI J-STD 001 " Drying / Degreasing states the assembly may be treated to remove moisture and other volitiles" I have contacted one board manufacturer who states that it is recommended to bake a board to remove volitles. Are
Electronics Forum | Wed May 17 05:13:22 EDT 2000 | Chris May
You can refer to ANSI/J-STD-001B section 6.4.3.1 which states: "When part stacking is permitted by the assembly drawing(s)/ documentation, parts SHALL not violate minimum electrical spacing between other parts or components such as terminals or othe
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