Electronics Forum | Fri Nov 14 07:56:49 EST 2008 | davef
Section 9 of J-STD-001 gives you what you need. Further: * Flattened [coined] lead: http://workmanship.nasa.gov/lib/insp/2%20books/links/sections/files/711.pdf * Flat lug lead: Look for the Package Designator �LT� on page 7 of http://www.allegromicr
Electronics Forum | Sun May 02 11:44:03 EDT 2010 | davef
J-STD-001 is your base requirement, but MIL and SPACE have stringent requirements for soldering gold plated terminals, e.g. this typical one: http://xweb.nrl.navy.mil/glast/CALDesign/CDE/CAL%20DPD%20Wire%20Cable%20Soldering%20and%20Staking%20Spec%20
Electronics Forum | Thu Sep 05 22:36:38 EDT 2013 | davef
Yes, providing your: * Inbound material does not compromise your process. * Soldering processes apply the proper amount of flux and activate it properly * Material handling does not contaminate your boards Recognize that the IPC requirements of less
Electronics Forum | Thu Nov 29 22:51:18 EST 2018 | jandon
IPC J-STD-001F: 6.2.1 Solder Application: Solder shall (N1D1D3) only be applied to the one side of a PTH except for intrusive soldering. Heat may be simultaneously applied to the both sides of the PTH.
Electronics Forum | Wed Mar 27 04:32:49 EDT 2019 | pavel_murtishev
Charliem, Thank you for the input. Following this logic, in case if there are no soldering issues, pad coverage and voiding levels are within acceptable limits and a gap between BTC and pad let us say 200um, this could be accepted, right? IPC-A-61
Electronics Forum | Thu Sep 27 19:52:28 EDT 2001 | davef
All of the discussion of "environmental controls" are a matter of degree, dependent on the requirements of the product that you manufacture. For example: shops assembling under-the-hood products have different requirements than shops making garage d
Electronics Forum | Thu Jul 18 13:11:56 EDT 2002 | gdstanton
Steve, We are touching up 6 - 12% of all solder joints processed. We consider the solder joint to be the focal point of the SMT process. Therefore our metric is based on it. For example in a given month we... 1. Assembled 25pcs of 'A' (IPC-A-610/J
Electronics Forum | Mon Dec 15 16:16:42 EST 2008 | davef
J-STD-001 requires that solderable surfaces of components and connectors be degolded prior to soldering. As proven methods for removal of the gold plating and replacing it with tin/lead, MIL-STD-2000 and J-STD-001 endorse[d] either: * Double dip (two
Electronics Forum | Mon Apr 06 10:32:53 EDT 1998 | Justin Medernach
| Peter, | Take a look at IPC-ANSI J-STD-001A and B, J-STD-004 and I think, 005/006 which cover solder paste (?) I think. | Whatever, they do reference one another. | | Question: Whatparameters are used to determine "good" Solder Paste? What refer
Electronics Forum | Mon Apr 10 22:32:14 EDT 2000 | Dave F
Mark: If you're looking for a baseline document for judging the acceptability of: * Mechanical assembly * Component installation * Soldering * Cleanliness * Marking * Coating * Laminate condition * Discrete wiring * Surface mounting of components .
.gif)
winsouce.jpg)