Electronics Forum: j-std-001 (Page 16 of 26)

Hi anyone have recommended pcb manufacturer?

Electronics Forum | Thu Jul 07 07:09:16 EDT 2016 | soldertools

BEST is an IPC Master Certification Solder Training Center offering Instructor and Operator courses for IPC-A-610, IPC J-STD-001, IPC/WHMA-620, IPC-A-600, IPC-6012 and IPC 7711/7721. BEST is also known world widely for PCB repair kits and materials t

Butt connector

Electronics Forum | Tue Oct 15 17:54:08 EDT 2019 | davef

From J-STD-001: Components designed for pin-in-hole application and modified for butt connection attachment, or stiff-leaded dual-inline packages (e.g., alloy 42, brazed or tempered leads) may be modified for use on Class 1 and 2 products but shall n

Sn Content in Sn63 Pre-Tin

Electronics Forum | Thu Sep 07 15:20:58 EDT 2023 | rjroaquin6

Hello All, I recently had a case of excessive tin coming from a solder pot sample. The solder is SN63 but the results of testing had a 64.97% for Sn. The J-STD-001 spec is 61.5% to 64.5%. The pot is used to pre-tin wires which will then be solder

What is the best IPC standard to refer to for Cleaning of Printed Board Assemblies? Thanks, Joe

Electronics Forum | Wed Mar 13 13:08:31 EDT 2024 | lambert

Section 8 in the J-STD-001 was the initial place to start with cleaning and the requirements, however with all the changes going on within the industry with increase product densities and such, a revision is being created to help understand the need

What is the best IPC standard to refer to for Cleaning of Printed Board Assemblies? Thanks, Joe

Electronics Forum | Thu Mar 14 15:55:34 EDT 2024 | davef

Process Requirement Standard - J-STD-001 - Requirements for soldered electrical and electronic assemblies depicting minimum end product acceptable characteristics as well as methods for evaluation (test methods), frequency of testing and applicable a

BGA Voiding for RoHS

Electronics Forum | Fri Nov 13 08:27:43 EST 2009 | herman

Your customer is very unreasonable to demand void-free BGA SJs. Minor voiding is not a condition for rejection per IPC-A-610D, J-STD-001D, or even J-STD-001DS (Space addendum). Having said that, let me tell you that the voiding has little or nothing

Re: How to qualify the solder flux of a new vendor?

Electronics Forum | Wed Nov 17 11:20:23 EST 1999 | Dave F

Hey Gyver: If you don�t mind (which you don�t have any choice about, because I�m going to do it anyhow, cause it�s MY word processor), I�m going to respond genericly, but still be directed to your question. Much of the following is paraphrased from

Re: Prove no-clean is clean

Electronics Forum | Thu Sep 17 12:08:13 EDT 1998 | Graham Naisbitt

Wayne, I think Dave and Justin are correct but I would just add my twopennworth: Your customer presumably wants to know if the end-product will be reliable? If he/she wants you to prove cleanliness, ask them for the spec they want to work to and app

lead substrate materials

Electronics Forum | Wed Jan 30 17:44:38 EST 2002 | davef

The gold is compatible with your solder. Gold will dissolve in your solder very quickly. Assuming you have a fairly large [~ couple hundred pounds] solder pot, the gold will not, over the short term, affect the performance of the pot. The issue is

Bare PCB baking

Electronics Forum | Fri Nov 22 10:38:30 EST 2002 | slthomas

The follwing is from the Technet archives, per IPC's Jack Crawford. I dug it up during some investigation of a supplier's issues with humidity in an Asian plant: There is support for this in IPD-HDBK-001 w/Amendment 1 Handbook and Guide to Suppleme


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