Electronics Forum | Tue Feb 24 18:21:52 EST 1998 | Graham Naisbitt
You should refer to the IPC-J-STD001B and IPC-TM-650, they will give you good recommendations. Also, we do new reliability test systems and if you can give me your address and e-mail, I will send you some more info. Regards, Graham Naisbitt | looking
Electronics Forum | Sat Sep 29 08:19:16 EDT 2001 | davef
The current version of ANSI/J-STD-001, "Requiremnts For Soldered Electrical & Electronis Assemblies" is C [3/00]. The following sources can help you: * IPC http://www.ipc.org * SMTA http://www.smta.org * Document Center http://www.document-center.c
Electronics Forum | Sun Feb 03 08:44:25 EST 2002 | davef
There is no standard for baking an assembled board prior to BGA rework, nor should there be. The amount of time required to bake a board varies with: * Board material. * Board construction and layers. * Board size. * Components on the board. If som
Electronics Forum | Thu Aug 22 07:48:30 EDT 2002 | Dave Milk
While separating individual pcbs from a panel, operators have caused delamination of the edge of the board, at the tabs that were cut. How can these boards be repaired? The delamination causes them to fail J-STD-001C 9.2.1.1.d. Also, what would yo
Electronics Forum | Thu Dec 05 22:46:39 EST 2002 | davef
While J-STD-001 specifies an upper limit for acceptance of assembly, we use Resistivity Of Solvent Extract testing as a process control. In truth, this "LT 10.07 �gm/sg in NaCl equivalent" measurement has substantial limitations, not the least of wh
Electronics Forum | Wed Mar 12 10:25:29 EST 2003 | davef
J-STD-001C, 7.2.1 Flux Application says words to the effect of: When an external flux is used in conjunction with flux cored solders, the fluxes shall be compatible. Regardless of whether these are or not flux cored solders, this begs the question:
Electronics Forum | Tue Oct 07 08:38:05 EDT 2003 | davef
J-STD-001C requires removal of gold from (through-hole) component leads when the thickness of the gold layer is above 2.5 microns to prevent problems with embrittlement. The thickness of gold on an ENIG board typically is around 0.05 micron, resultin
Electronics Forum | Wed Oct 29 20:28:59 EST 2003 | davef
The possibilities are dizzying, aren't they? In our dingy fog, if we don't understand your requirement, say so. 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IP
Electronics Forum | Sat Feb 28 08:15:50 EST 2004 | davef
J-STD-001 has what you need. 3.6 Facilities ......................... 4 3.6.1 Environmental Controls ........... 4 3.6.2 Temperature and Humidity ......... 4 3.6.3 Lighting ......................... 4 3.6.4 Field Assembly Operations ........ 4 3.6.5
Electronics Forum | Fri Mar 19 13:42:05 EST 2004 | blu_nozer
J-STD-001 is the workmanship standard. IPC-A-610 is a guide to evaluating conformance to the standard & includes photographs of compliant and non-compliant examples. In addition there is also IPC-HDBK-001 which expands on the bare requirements laid d
