Electronics Forum | Thu Jun 15 20:24:45 EDT 2000 | Jeff Tamagi
In section 7.3.2 of ANSI J-STD 001 " Drying / Degreasing states the assembly may be treated to remove moisture and other volitiles" I have contacted one board manufacturer who states that it is recommended to bake a board to remove volitles. Are
Electronics Forum | Thu Mar 15 08:16:28 EST 2001 | davef
In a similar conversation ... Alex Krstic, NovAtel Inc. said ... Hello all. We recently received some boards with some of the chip resistors placed with their resistive elements towards the board. J-STD-001B and C view this as violation for both Cl
Electronics Forum | Thu Dec 08 07:55:16 EST 2005 | davef
Your understanding of the situation is correct. In both cases, you solder to the nickel. The gold [Au] protects the nickel from oxidation. When soldering, the gold moves into solution in the solder and forms an intermetallic compound [IMC] with th
Electronics Forum | Fri May 26 04:58:19 EDT 2023 | auriga2001
I agree with the two other replies. Left alone, it is a defect. If it's just excess adhesive or coating, you can use IPC-7711/7721 'Rework, Modification and Repair of Electronic Assemblies' for guidance on removing. Section 2.3.1 explains how to te
| 1 |
