Electronics Forum | Thu Jul 25 12:25:54 EDT 2019 | davef
In “J-STD-001 Rev G Amendment 1 Process Qualification” Debbie Carboni, Global Product Line Manager, KYZEN Corp, Nashville, TN said: What change constitutes a need for requalification? Major/ Level 1 – Flux or flux-bearing materials (e.g. flux, so
Electronics Forum | Tue Nov 18 18:25:57 EST 2003 | Gabriele
To process Multy Layer Ceramic Chip Capacitor is a critical process some time underevaluated mainly at rework or repair step. You can find useful guidelines on J-STD-001 G
Electronics Forum | Mon Jul 24 09:15:32 EDT 2017 | davef
James: This is not "breaking news." IPC-A-610F, Acceptability of Electronic Assemblies was released in July 2014. Both, ... * IPC-A-610G, Acceptability of Electronic Assemblies * J-STD-001G, Requirements for Soldered Electrical and Electronic Assem
Electronics Forum | Mon Feb 25 09:53:30 EST 2019 | tombstonesmt
Good morning! In order to comply with current IPC J-STD-001G Appendix A-2, I'm putting together a log to periodically monitor solder tip temp tolerance, tip resistance, voltage leakage, etc.. I'm solely focusing on the hand solder stations for the t
Electronics Forum | Thu Sep 15 08:39:10 EDT 2016 | davef
J-STD-001 Revision F with Amendment 1
Electronics Forum | Thu Mar 29 13:34:12 EDT 2007 | dekhead
You're correct Tim, amended above.
Electronics Forum | Mon Jul 04 09:08:41 EDT 2016 | davef
IPC/JEDEC J-STD-033B.1 Includes Amendment 1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices [http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf]
Electronics Forum | Fri Dec 14 08:31:51 EST 2001 | PeteC
For a reference check out IPC-SM-782A Amendment 2 "Surface Mount Design and Land Pattern Standard" BGA. It can be found at http://www.ipc.org
Electronics Forum | Mon Feb 04 20:27:25 EST 2002 | davef
1,000 G ohm ||100 M ohm Dielectric Constant ||9.5 ||4.9 Loss Factor ||5 - 20 ||200 * E indicates exponent Continuing: * Spacing between same plane traces effect the electical parameters between the traces. * Dielectric materials used between diff
Electronics Forum | Sat Jan 01 10:41:30 EST 2005 | davef
Is this what you're talking about? http://www.ustreas.gov/press/releases/js703.htm We don't believe the "Technology Investment Incentive Act of 2003" [108th CONGRESS, 1st Session, H. R. 1232: To amend the Internal Revenue Code of 1986 to shorten th
