Electronics Forum: j-std-001rev g move (Page 1 of 8)

Type 4 powder

Electronics Forum | Thu Jul 25 12:25:54 EDT 2019 | davef

In “J-STD-001 Rev G Amendment 1 Process Qualification” Debbie Carboni, Global Product Line Manager, KYZEN Corp, Nashville, TN said: What change constitutes a need for requalification? Major/ Level 1 – Flux or flux-bearing materials (e.g. flux, so

Solder Iron Tips - Acceptable Temp Tolerance?

Electronics Forum | Sun Sep 02 09:06:42 EDT 2018 | davef

Cold resistance between the tip of the tool and the ground reference, tip current leakage, and tip voltage. per ANSI ESD STM 13.1 J-STD-001 Rev G, Appendix “A” Guidelines for Soldering Tools and Equipment: A-2 BENCHTOP AND HAND SOLDERING SYSTEMS Se

ASYMTEK FM FluidMove 3.3G

Electronics Forum | Wed Nov 29 15:54:30 EST 2023 | xxxxx1

Hi Everyone, please someone help me. Disc 2 (2/4) of my ASYMTEK FM 3.3G software is damaged. can someone help me to replace a floppy disk? it would be great if i could download it or if someone could send me the files. Thanks!

Die placement with MPA-G3 pick and place

Electronics Forum | Thu Jun 06 07:53:51 EDT 2002 | Jim M.

Has anyone had much luck Picking and Placing die with a Panasonic MPA-G3?What special setups or considerations are required? Currently we pick and place one die with our Universal GSM using only one nozzle. The nozzle must be painted white in order

Re: You choose: F4G or MCS-30

Electronics Forum | Mon Oct 18 11:28:47 EDT 1999 | David Spilker

I was wondering why you did not include FujiCam on your list of options. We are moving from MCS to FujiCam (with a few slips along the way).

Fujicam programming

Electronics Forum | Thu Apr 01 17:15:05 EST 2004 | ricardof

What programming systems are you using now? F4G is no longer supported, so I guess that's not a relaible option to move on. FUJICAM is currently in good shape, most of the bugs are cleared

IPC A-610 Moving from Rev E to Rev F

Electronics Forum | Thu Jun 29 15:02:56 EDT 2017 | dleeper

Hasn't rev F been out for a few years now? I'm more interested in what's changing in rev G.

component aherence force on the solder paste before reflow

Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte

If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at

Machine capability studies

Electronics Forum | Tue Oct 18 04:44:44 EDT 2005 | dougs

these are two separate things, your MSA is measurement systems analysis, moving a machine won't change the way you measure your machines performance so you don't need to do MSA again. you should check machine capability once a machine is moved thoug

Die placement with MPA-G3 pick and place

Electronics Forum | Thu Jun 06 08:16:13 EDT 2002 | caldon

Jim- Sorry I can not offer advice on the Panasonic machine but do want to shed light on the Die and waffle pack issue. Take note that if the Die are loose in the pockets the balls or terminations could be damaged. The thin layer that the ball is atta

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