Electronics Forum | Sun Mar 25 22:21:03 EDT 2007 | sleech
Let me explain. At 125 degrees C, the oven is above the boiling point of water. It will be vaporized and eventually be vented from the oven. However at temperatures of 90 degrees c and lower the relative humidity becomes an issue. For the life of me,
Electronics Forum | Wed Sep 23 14:30:05 EDT 2015 | deanm
"...air evacuation is not required (Figure 3-5). Light air evacuation may be used to reduce the packaging bulk and enhance carton packing (Figure 3-6). Full evacuation shall not be used as it will impede desiccant and HIC performance and possibly lea
Electronics Forum | Wed Jul 17 06:54:17 EDT 2013 | deanm
We manufacture according to military Class 3 standards and we do not vacuum seal any MSD devices. Your current method of dry packing is sufficient as well as dry cabinet or nitrogen storage. A light evacuation of air during the dry packing process
Electronics Forum | Sat Sep 10 17:12:18 EDT 2022 | yannick_herzog
Hello, we use an oven to dry our MSL components after the floor lifes expires. The oven works at 40°C / 0.1% RH. The plan is to upgrade the oven from 40°C to 60°C to shorten the duration of the process. I have found a number of articles mentioning
Electronics Forum | Thu Jul 05 11:26:08 EDT 2012 | cobham1
I need help with how long do I need to bake out double sided PCB's that have been cleaned. The units will not be reworked but instead will be moved on to hand stuffing. I have looked in IPC CH-65B and J-STD-033C. I get information for parts if I am r
Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech
Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro
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