Electronics Forum | Thu Aug 16 13:02:28 EDT 2001 | jfure
Thank you Dave, these links were what I wanted. Jan
Electronics Forum | Fri Apr 11 05:51:20 EDT 2008 | janz
w/4t=0.8 Regards Jan
Electronics Forum | Wed Apr 16 02:46:55 EDT 2008 | andrzej
Thanks Jan for hints
Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej
Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio
Electronics Forum | Fri Feb 18 01:15:27 EST 2000 | sin
Jan, have you try to teach on hsp4791 see if it's ok. Normally, what would happen is the lighting. Do you know how to calibrate the lighting on HSP?
Electronics Forum | Sat Jun 17 12:54:41 EDT 2000 | Jan Rinaldo
Does anyone have an idea if it's possible to transform a program created in Adhesive Dispenser 4713(Universal) to GDM 4716 from the same brand ? Thanks in advance, Jan
Electronics Forum | Sun May 21 10:39:35 EDT 2000 | Jan Rinaldo
Does anyone have experience with this machine? I'm having some troubles with it. Recognition system is the most critical of them. Thanks in advance, Jan
Electronics Forum | Fri Feb 18 01:15:27 EST 2000 | sin
Jan, have you try to teach on hsp4791 see if it's ok. Normally, what would happen is the lighting. Do you know how to calibrate the lighting on HSP?
Electronics Forum | Thu Jan 14 23:49:00 EST 1999 | Wirat Sriamonkitkul
I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? Thank you, Wirat S. / Jan 15
Electronics Forum | Tue Jan 05 18:09:00 EST 1999 | Elaine Luk
Jan 05, 1999 My question is: Pls kindly advise what is the meant by a "Think Film hybrid design" and what are the advantages it would have on surface mount passive components e.g. capacitors and reisitors?? Thanks for your respond. Elaine
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