Electronics Forum: job (Page 172 of 224)

Re: Surface mount machines

Electronics Forum | Tue Aug 17 03:33:26 EDT 1999 | Scott Davies

Anybody using trolleys with the pick-n-place machines and do you splice to the empty reels? Does it work ? ================================================================= I can totally support Charles' comments with regard to reel splicing, ie. if

Re: Solder Beading Solder Balling

Electronics Forum | Thu Aug 05 11:15:39 EDT 1999 | John Thorup

| | | | | | | | | Hello, | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip compon

Re: Baking Components ?

Electronics Forum | Fri Jul 30 17:22:48 EDT 1999 | Dave F

| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so

Re: Baking Components ?

Electronics Forum | Fri Jul 30 17:26:02 EDT 1999 | John Thorup

| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so

Re: Is baking PCB necessary before solder process?

Electronics Forum | Wed Jul 28 20:56:58 EDT 1999 | Dave F

| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into

Re: testing after SMt assembly

Electronics Forum | Thu Jul 29 01:01:11 EDT 1999 | DLKearns

| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | Hunter, YES ICT after SMT reflow is expensive, we currently onlt t

Re: BGAs and vapor phase

Electronics Forum | Mon Jul 19 11:11:18 EDT 1999 | Wolfgang Busko

| Perhaps a little hard to find but is there anyone who uses a vapor phase process to solder populated card with BGAs. I am interested in the success rate of such a process. It is obvious that the throughput is reduce vs a convection oven but still t

Re: BGAs and vapor phase

Electronics Forum | Mon Jul 19 11:50:47 EDT 1999 | Mario

| | Hi, SMTASSY | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | First, we do not do real series produktion, only prototyping up to sometimes 20 uni

Re: Stripping Magnet Wire

Electronics Forum | Fri Jul 16 21:56:04 EDT 1999 | Jeff Sanchez

| | | I need a good chemical to remove the lacquer finish off of magnet wire. I know there are different kinds but I need one that really works. Any suggestions would be great. thanks in advance guys. | | | | | What is it you're trying to do? | | D

Re: X-Ray for CSP devices

Electronics Forum | Fri Jul 16 10:32:52 EDT 1999 | Upinder Singh

| | Hello All, | | I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? | | Also anyone who is mou


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