Electronics Forum | Wed Sep 11 07:23:07 EDT 2002 | johnw
peter, define what you class as SPC for these area's, or do you just mean looking at the PPM or DPM levels? John
Electronics Forum | Wed Nov 29 17:00:40 EST 2006 | John S.
We've used both effectively to resolve this issue. Check with your stencil manufacturer. Often, they can give you a very good starting place on issues like this since they see everyone's designs. John S.
Electronics Forum | Fri Jun 06 07:34:43 EDT 2003 | johnw
Rick, my understanding is that the US do not have plan's fr lead free legislation. However the European legislation states that any product entering the european market after June 2006 must meet the lead free std's of the directive. So basically if
Electronics Forum | Thu May 06 10:52:08 EDT 2004 | John S
Many component manufacturers are moving to Pb free terminations. I've been doing a literature study of Pb free processing and have found several articles that indicate Pb-free paste with Sn/Pb terminations leads to early fatigue failures. Does anyo
Electronics Forum | Wed May 24 16:19:58 EDT 2006 | inds
John, there have been quite a few discussion on Mixed Assemblies in this forum.. do a search.. you will get whole lot of information.. in addition - IF you are using Lead-free reflow profile...make sure the rated temp for Sn-Pb components is not vi
Electronics Forum | Thu Jan 24 19:58:58 EST 2002 | davef
for regular eutecticish solders, keep the pot temperature between 230�C [446�F] and 290�C [554�F]. If you polled us on our pot temperatures, we�d be all over the map, but with more lower than higher than you. High pot temperatures tend to generate
Electronics Forum | Thu Aug 01 12:55:41 EDT 2002 | johnw
we run the paste in both air and n2 depending on customer requirements again it run's fairly well in both. Some people say it's better sme say it doesn't make a bit of difference, I'm somewhere in between at the moment. I definately think there's imp
Electronics Forum | Fri Apr 03 08:34:54 EDT 2020 | SMTA-Gregory
We need to be careful with product to avoid introducing a new failure mode, namely corrosion and dendrite growth, especially those running no clean processes! In addition to heat (reflow, wave and some selective soldering processes) killing the vi
Electronics Forum | Fri Aug 02 12:01:40 EDT 2002 | johnw
interesting, not at all what we were told so yes lot's of contradictions comming from them, I have to say personally I've not beein impressed with there technical service of late, are they getting complacent I ask? it's strange they say it'll cause
Electronics Forum | Thu Mar 23 12:11:20 EST 2006 | patrickbruneel
Here's a (427 page) EPA report on Solders in Electronics: A Life-Cycle Assessment http://www.epa.gov/opptintr/dfe/pubs/solder/lca/lfs-lca-final.pdf If you look at page ES-16/table ES-4 and ES-5 it appears that SAC alloys have a higher impact on the
