Electronics Forum | Fri Nov 23 02:46:11 EST 2001 | anders
We are currently handsoldering PCB jumpers. Does anybody have any experience on how the PCB-pad footprint design should be for screenprinting PCB jumpers to ensure that the connection is soldered?
Electronics Forum | Tue Nov 27 01:43:29 EST 2001 | Anders
The reason why we are using soldered PCB jumpers is that it is cheaper than dip-switches, 0 ohms resistors, etc. Field updating is also easier. We are producing different variants of some of our products. It would nice if we could presolder the PCB
Electronics Forum | Tue Nov 27 15:57:58 EST 2001 | mparker
rather than applying jumpers, try thinking it another way. Have all possible jumper connections pre-made by the fab design. Use an exacto or dremel to "open" the undesired paths by removing a bit of copper trace. total flexibility, only one fab make
Electronics Forum | Mon Nov 26 19:58:54 EST 2001 | davef
Depends on what you're talking about. For instance: Jumpers between pads: Why not use SMT jumper components? Long ECO jumper runs: When we have a serious problem in the design of our boards, we contract thick film additive jumper work. Search th
Electronics Forum | Thu May 28 08:39:13 EDT 1998 | Rob Williams
I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not able
Electronics Forum | Thu May 28 08:38:43 EDT 1998 | Rob Williams
I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not able
Electronics Forum | Wed Jun 03 09:48:47 EDT 1998 | Gary
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Tue Nov 27 10:16:07 EST 2001 | davef
Oooo, I get it. We do that trick on the wave solder side of boards. On the bare board, during design / layout, the basic shape of the jumper is a 125 thou disc of copper [that of course is eventually covered with whatever solderability preservative
Electronics Forum | Thu May 28 09:48:08 EDT 1998 | Steve Herring
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
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