Electronics Forum | Sun Feb 26 13:49:18 EST 2006 | masrimhd
Hi, We will run a no-clean wave solder process to assemble TV boards. What about incorporating a ROSE Test equipment (Ionograph, zero-ion, Omega Meter) in the process? Is it recommended, helpful or unnecessary? I�ve read about the use and limits of
Electronics Forum | Mon Feb 27 19:48:32 EST 2006 | stepheniii
I'm not sure that would be valid. My understanding was that solids were trapped by other non-active flux residue. Which is why you can leave them on and why you see white residue after washing. I think the ROSE test would release particles that woul
Electronics Forum | Mon Feb 27 13:02:13 EST 2006 | masrimhd
Hi, Thank you for your answers. But I want to explain some points on which I would appreciate any comment: * Having calibrated the process, we intend to carry out the ROSE test just on SAMPLES of the finished boards. Lets say one every hour. I exp
Electronics Forum | Thu Mar 02 23:21:59 EST 2006 | KEN
I recently finished analysis of no-clean fluxes and Ionic contamination and cleaning processes. The results were eye opening. Summary: If you clean a no-clean you better do a good job. Many no-cleans produce a "waxy binder" to encapsulate the tro
Electronics Forum | Sun Feb 26 17:40:35 EST 2006 | GS
Hi, just my comment, theoretically No Clean means no Ion Contaminants from Flux, but it some some case ion contamination (Cl-Br-F) could come out from raw PCBs, from Components, from fingerprints, etc. To incorporate a ROSE step in the pro
Electronics Forum | Sun Feb 26 21:48:28 EST 2006 | Mike Konrad
Hi GS, Just a clarification� No-clean does NOT equal no ions. It equals less ions (at best). Automatic R.O.S.E (Resistivity Of Solvent Extract) testers are commonly used to detect ionic contamination from no-clean applications. Your comment rega
Electronics Forum | Tue Feb 28 14:32:26 EST 2006 | masrimhd
As I know, the encapsulation effect occurs only with rosin based fluxes. So if you have a PBA soldered using RA Flux, you should either wash it well, or leave it alone and it will be safe. For NC process the story is different because there�s no re
Electronics Forum | Mon Feb 27 17:08:15 EST 2006 | GS
3,5 ugr/cm2 NaCl) or power components, or Raw PCB. Nothing with the solder process or fluxes. Ion Chromatography analysis was necessary to help understanding of contamination origin. When occasionally we run TIC on a NC assembled PBA (Paste ROL0 or
Electronics Forum | Mon Jul 24 06:22:54 EDT 2023 | abhishek10
Thank you so much for the explaination.Is their any method to prevent lead lift during handling.some kaizen idea?
Electronics Forum | Thu Apr 17 22:20:39 EDT 2003 | davef
Q1: Industry standard detailing solder joint quality? A1: ANSI/J-STD-001 - Requirements For Soldered Electrical & Electronis Assemblies is the mutha of industry standard detailing solder joint quality.
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