Electronics Forum | Tue Sep 09 16:17:45 EDT 2008 | boardhouse
Logannsan, you may want to check into this a little more with your customer to find out what 2 is. It could be as Vlad say's 2Ag -silver, or it could be 2CU -copper or 2Ni- nickel. Also check this form for 62Sn 36Pb 2Ag just my 2 cent. Regards
Electronics Forum | Wed Sep 10 17:21:08 EDT 2008 | gregoryyork
Strange we use the 179~C eutectic 62/36/2 solder paste as standard in Europe. It is indeed 2% Ag in fact we dont sell 63/37 paste or very rarely. I think if you mix a little 60/40 powder with the 2% Ag alloy this overcomes the tombstoning problem.
Electronics Forum | Tue Aug 14 21:51:29 EDT 2001 | mugen
true.... tata why the elongation% is there.....
Electronics Forum | Wed Aug 23 16:46:52 EDT 2000 | Dr. Ning-Cheng Lee
Comparing 62Sn/36Pb/2Ag with 63Sn/37Pb, addition of 2% Ag introduces two major advantages. The first advantage is grain refining, and the resultant better fatigue resistance. The second advantage is a wider processing window on Ag metallization. Pres
Electronics Forum | Tue Aug 14 20:47:29 EDT 2001 | Pete
Hi, would like to get good info on the above solder paste metal content regarding their advantage and disadvantage against each other and their effect on fine pitch solderability. regards,
Electronics Forum | Tue Aug 14 21:48:54 EDT 2001 | davef
Say isn't creep a more key issue, rather than strength?
Electronics Forum | Tue Aug 14 22:21:55 EDT 2001 | davef
But isn't elongation more of a quantification of ductility than of creep?
Electronics Forum | Thu Aug 16 05:29:29 EDT 2001 | mugen
Say din't someone previously claim, "Dave F" stands for : Damm.Averted.Verified.Eggbrain.Freakin *smart* ?!?
Electronics Forum | Thu Aug 16 19:58:49 EDT 2001 | davef
Just feel relieved that we didn't go to the matt on the use of "leaching" rather than "dissolution". And you thought this was easy, eh?
Electronics Forum | Thu Mar 02 15:12:50 EST 2000 | Robert Hartmann
To restate my question of earlier, if I have a .020" sphere before reflow, and my pad opening in the dielectric is .017", is there a rule of thumb to calculate the height of the sphere after reflow? We are using 62Sn/36Pb/2Ag spheres. This should h
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