Electronics Forum: key pad (Page 1 of 11)

Carbon Ink vs Immersion Gold for key pads.

Electronics Forum | Tue May 02 20:55:10 EDT 2006 | Board House

Hi all, I'm looking for anyone with info in regards to reliability of carbon ink vs. Immersion Gold Key pads. I have customers that still request Carbon Ink for there Key pads, while the majority have switch to Immersion Gold. Is there any readin

Carbon Ink vs Immersion Gold for key pads.

Electronics Forum | Wed May 03 15:56:25 EDT 2006 | Board House

Hi Patrick, Thank you for the info, We like to push ENIG, for us being the ENIG line is in house it is cheaper to use than the carbon, plus shelf life of the Carbon is an issue in Storage. Pre-application. Thanks again, Mike

Carbon Ink vs Immersion Gold for key pads.

Electronics Forum | Wed May 03 22:14:29 EDT 2006 | davef

We think well done carbon ink and well done ENIG are equally reliable [maybe 1M operations]. If the gold is pourous [not all that an uncommon], ENIG is far less reliable than carbon ink.

Carbon Ink vs Immersion Gold for key pads.

Electronics Forum | Wed May 03 15:00:44 EDT 2006 | patrickbruneel

It all depends on process, design and environment in which the contacts are used. Both have excellent conductivity characteristics Both don't oxidize over time On the other hand gold is much softer then carbon, and after hitting that contact a gazil

BGA ball and PCB pad

Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack

Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg

Placement of 32 pin QFN w/t ground pad

Electronics Forum | Fri Oct 09 00:57:05 EDT 2009 | jjmag921612000

SteveO, I had personal experience with this using a Panasonic MPAV2B. It took a while, but I believe the end result was to have some additional "Z" travel to press the QFN into the paste. Also, the design of the paste on the ground was key to keep t

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Wed Dec 08 10:10:41 EST 1999 | John Thorup

Hi Dave I think you just provided the key to understanding the problem. By your description you are talking about a CBGA (ceramic). These typically have balls composed of 10/90 Sn/Pb which melts at a higher temperature than the 62/36/2 Sn/Pb/Ag (or

Fuji CP643 question

Electronics Forum | Wed Apr 29 16:13:53 EDT 2009 | jimmyboz

Hit the help key while cursored on that category,(televideo monitor) if the sticker wore off, its one of the keys in the upper right, below the the F keys, above the number key pad, let me know if you got it.

ENIG used with stainless-steel membrane switch

Electronics Forum | Thu Jul 24 22:58:13 EDT 2008 | davef

At the 2004 IMAPS Nordic Conference, Claus W�rtz Nielsson from Nokia Mobile Phones published "The Evolution of Surface Finishes in Mobile Phone Applications" [www.imaps.org/adv_micro/papers/Nordic2004paper.pdf]. Some of the results were: * Corrosion

Changing Ni/Au finish to HASL lead free

Electronics Forum | Thu Jan 06 17:33:07 EST 2011 | boardhouse

Hi Johan, Sounds like you have already gone over your product very well to reduce product cost. Switching away from Deep gold Tabs & carbon ink Key pads can save quite a bit. The only other thing to suggest would be material - Moving away from Isol

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