Electronics Forum | Wed Jan 21 10:41:57 EST 2004 | davef
Depending on how you frame the question, either of you could be correct. Neither of you mentioned stencil thickness, which together with aperture opening [and stencil fabrication technology] define how well a paste will release. So, the key measure
Electronics Forum | Wed Aug 09 19:14:41 EDT 2023 | solderingpro
In today's fast-paced manufacturing landscape, Surface Mount Technology (SMT) factories are seeking ways to enhance efficiency and flexibility while maintaining high-quality standards. The evolution of Autonomous Mobile Robots (AMRs) has provided an
Electronics Forum | Tue Oct 27 07:09:37 EDT 2015 | prameel_84
Hi Everyone, I got an approval to buy a Ionic Contamination Tester in my company, hence i require expert advise to proceed further for machine procurement At present I've fixed for Zero-Ion G3 Ionic Contamination of Aqueous Technologies and SMD V T
Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef
What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC
Electronics Forum | Mon Dec 07 16:37:10 EST 2015 | ilavu
Hello, I am looking for the old version of installation software for Vi Technology "Avision 4.4". My CD is bad and manufacturer is asking lot more than the machine worth. I said old software is because, Old version works with hardware dongle that I h
Electronics Forum | Wed Jun 24 18:41:23 EDT 1998 | Bill Chrisitian
| Dennis, thanks for your input. I myself can't remember having any caps fail due to thermal stress/cracking. But the guru's here says it happens and since the assembly is for space flight, it's a requirement to preheat. Also, your process is exactl
Electronics Forum | Thu Jun 25 11:53:09 EDT 1998 | Dave F
| | Dennis, thanks for your input. I myself can't remember having any caps fail due to thermal stress/cracking. But the guru's here says it happens and since the assembly is for space flight, it's a requirement to preheat. Also, your process is exac
Electronics Forum | Wed Dec 24 22:46:58 EST 1997 | Scott McKee
| Can anybody give me feed back on the pro and cons of | using Pace, OK, Hakko, Metcal, etc... equipment in | their rework processes? I need to set up a low volume | rework station for mixed technology boards. | Would appreciate any suggestions. I
Electronics Forum | Mon Dec 18 14:49:23 EST 2000 | Charles Harper
Probably the most important recent event has been the acquisition of International Flexible Technologies by Scheldahl,whose strength in flexible materials will have a major growth impact for flexible circuits--already growing nicely.Also,continuing a
Electronics Forum | Wed Sep 25 09:24:54 EDT 2002 | caldon
Michael- Please when concidering you U-sonic machine, keep in mind possible chemistries Petroferm, Kyzen, Aqueous technologies, and Zestron products. All are good products and all need to be evaluated with your stencils. Depending on your component t
