Electronics Forum: kinetics (Page 1 of 1)

Conveyor belt moves opposite direction

Electronics Forum | Tue Apr 16 19:59:32 EDT 2019 | davef

Tel: 0115 955 4506 Kinetic Conveyor & Roller Systems Unit 2 Enterprise Park Wigwam Lane Hucknall Nottingham NG15 7SZ Email: sales@kineticbelting.co.uk

Silicone for bonding?

Electronics Forum | Mon Oct 06 18:41:47 EDT 2003 | davef

In addition to our earlier comments, do not be misled into thinking that silicone materials, being rubbery, will transmit shock less. Nothing is farther from the truth. Many silicone rubbers are almost totally incompressible in the short time scale.

Re: water soluble mask

Electronics Forum | Mon Sep 27 08:52:11 EDT 1999 | Brian

| i had a problem here, during the wave soldering process, we apply a water soluble mask on the gold finger to protect it from contamination. But after washing, there is still some mask left on the gold finger. | Can anyone pls advise is there any pa

Inline Washers

Electronics Forum | Thu Mar 20 13:22:27 EST 2003 | bmaheu

James, I've done some extensive studies cleaning BGA's while I was employeed by one the companies you are considering. In an attempt to avoid being commercial I will use general statments to address your question(s). The key to cleaning underneath

Re: help help! Water clean for CSP/BGA package

Electronics Forum | Tue Oct 05 04:01:36 EDT 1999 | Brian

| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl

A.O.I - no salesman pitch pls

Electronics Forum | Tue Jun 10 01:09:37 EDT 2003 | iman

Hi! Thanks to you as the first replier! I do admit it "narrows" the information channels feedback flow by keeping this thread reply limited to "non-commercial" engineering folks, but I already have lotsa war stories from the salesmen around this reg

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

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