Electronics Forum | Tue Dec 04 13:23:05 EST 2001 | fmonette
Hi Steve, It sounds like your product will have many moisture-sensitive devices on both sides. You should be aware of the additional controls that are required to insure the reliability of these components in a double-side reflow application. The
Electronics Forum | Fri Jul 24 10:36:48 EDT 1998 | Dave F
| | Hi, | | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | | Any good suggestion would be highly appreciated! | | Stone
Electronics Forum | Fri Jul 24 02:32:35 EDT 1998 | Frank J. de Klein
| Hi, | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | Any good suggestion would be highly appreciated! | Stoney Tsai *
Electronics Forum | Tue May 14 14:48:33 EDT 2002 | fmonette
Hi Dason, Here is some relevant information that you might find useful : J-STD-033, section 7.1.2.2 Dry Box : "Components may be placed in a dry box, capable of maintaining 25+/-5C and less than 10%RH. Nitrogen or dry air may be used." In other w
Electronics Forum | Mon Jul 27 03:20:42 EDT 1998 | Frank J. de Klein
Dear Dave, Sure we can ! There are two values going around. One is 50 mg/mm2 The other one is 30 g/inch2 (30 * 1000) / (25.4 * 25.4) = 46.5 mg/mm2 So we are talking the same language. Regards, Frank J. de Klein | | | Hi, | | | We have encountered one
Electronics Forum | Fri Jul 24 08:52:42 EDT 1998 | Justin Medernach
| | Hi, | | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | | Any good suggestion would be highly appreciated! | | Stone
Electronics Forum | Sat Jul 25 00:09:13 EDT 1998 | Phillip Hunter
Use caution if epoxy is dispensed under the PLCC 84. If the "SMT Gods" look unfavorably onto you rework will be difficult. I had a ceramic PLCC 84 which weighed 15 grams (MCM) and due to packaging failures (glass seal to metal cover) rework was the
Electronics Forum | Thu May 13 17:31:48 EDT 2021 | bandjwet
We have a PCB rework dilemma involving a reflow profile. This is a SAC305/Low Solids (aka no clean) process where we are currently hand soldering (5) components that were DNP. The boards have an acrylic coating and we take off the acrylic at the par
Electronics Forum | Wed May 12 10:29:25 EDT 1999 | Timothy O'Neill
| | | Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not? | | | I do not think there is a "typical" post reflow cooling rate
Electronics Forum | Tue Oct 12 05:09:13 EDT 1999 | Brian
| | | | | | | Can anyone tell me the formula/method to determine | | | | | | | the amount of weight that solder's surface tension can support. | | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | | of a board during
