Electronics Forum: labels come off during cleaning process (Page 1 of 27)

parts popping off during reflow

Electronics Forum | Thu Sep 13 17:57:59 EDT 2001 | davef

You're correct. It is curious. Possible angles to look at are: 1 WS609 loves moisture in the air. In high humidity shops, this paste hakes-on liquid. If this is the case, you should also see slumping, resulting in fine pitch bridging, and solder

Flux burn off

Electronics Forum | Wed Jul 20 16:02:05 EDT 2005 | Inds

guys, I am having a problem. During my rework (SRT) process, I am trying to reach a board temp of 150degC b4 the top heater comes down for the actual rework process. Due to which the flux (tacflux 20)is burning off and i am seeing lot of non wetting

Lowering Nitrogen Levels to burn off flux residue

Electronics Forum | Fri Aug 11 06:48:38 EDT 2000 | GJ

I am currently building boards which have to be conformal coated (done by an outside source) in a no clean process. The conformal coating however, must be applied to a clean surface. The flux residue left from the paste has come into question. I h

Underscreen cleaning cycles

Electronics Forum | Fri May 11 14:19:14 EDT 2012 | cyber_wolf

Regarding nano coatings : Nano coatings are susceptible to wear during the printing process and cleaning processes. As they wear they flake off and can potentially contaminate your solder. There is not a lot of independent data available on this so k

Solder Mask Bubbling off after Wave Soldering

Electronics Forum | Mon Apr 03 23:17:51 EDT 2000 | Brian G

We have been experiencing intermittent problems with the solder masking bubbling up from the bottom side of the board, after wave soldering. Our board fabricator claims that none of his other customers are experiencing this problem, and that it is pr

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:39:39 EDT 1999 | M Cox

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: Flux splattering during reflow

Electronics Forum | Mon Jan 19 20:01:11 EST 1998 | Steve Gregory

| We use no clean paste and sometimes experience | flux splattering which gives spot on gold fingers. | Need help in analize the cause. thx. Dominic, That is STILL a problem huh? It's a tough one to solve sometimes...especially when you have as

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 10:21:06 EDT 1999 | Earl Moon

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

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