Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Thu Jun 04 20:06:30 EDT 2009 | davef
Since posting the above comment extolling the virtues of NSMD pads and disparaging SMD pads, we've learned that the points apply to all array devices, but in spite of that some designers of fine pitch [eg, 0.4, 0.5mm pitch] array devices choose SMD w
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Tue Apr 27 12:32:53 EDT 1999 | Frank Hinojos
What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank
Electronics Forum | Mon Nov 20 13:18:38 EST 2000 | Steve Schrader
Is anyone populating boards with LGA's on a production basis? If so, what process issues should I be concerned with and what challenges do they present that would be different from BGA assembly? Thanks. Steve
Electronics Forum | Thu Aug 03 11:32:44 EDT 2000 | bzark
Any opinion on what size aperture and stencil thickness is most optimum for Land Grid Array 1.27mm pitch with .6mm pad using SN/AG NC solder paste?
Electronics Forum | Tue Aug 26 08:21:04 EDT 2008 | davef
The fine SMTnet Archives has a recent thread http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=54857
Electronics Forum | Tue Sep 09 14:49:13 EDT 2008 | ksrsr
We get our component stencil for this type of rework from Mini-Micro Stencils. We use a Air-Vac rework station and we have no issues at all.
Electronics Forum | Thu Apr 14 09:45:58 EDT 2016 | emeto
Why don't you fix the PCB flatness instead? If that is not the problem, I will check the part warping during the reflow process.If the part is large as you mentioned, it probably warps a lot during reflow. Try to bake the parts in front,based on MSL
Electronics Forum | Thu Apr 14 09:47:46 EDT 2016 | emeto
You can also try different paste from what you are using(may be paste with lower melting point).
