Electronics Forum | Tue Apr 27 12:32:53 EDT 1999 | Frank Hinojos
What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank
Electronics Forum | Tue Apr 27 13:00:05 EDT 1999 | Justin Medernach
| What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | Thanks, | | Frank | Frank, Refer to the device manufacturers. they are going to have a recomme
Electronics Forum | Wed Apr 28 14:41:45 EDT 1999 | Bob Willis
| | What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | | | Thanks, | | | | Frank | | | Frank, | Refer to the device manufacturers. they are going t
Electronics Forum | Mon Nov 20 13:18:38 EST 2000 | Steve Schrader
Is anyone populating boards with LGA's on a production basis? If so, what process issues should I be concerned with and what challenges do they present that would be different from BGA assembly? Thanks. Steve
Electronics Forum | Thu Aug 03 11:32:44 EDT 2000 | bzark
Any opinion on what size aperture and stencil thickness is most optimum for Land Grid Array 1.27mm pitch with .6mm pad using SN/AG NC solder paste?
Electronics Forum | Tue Aug 26 08:21:04 EDT 2008 | davef
The fine SMTnet Archives has a recent thread http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=54857
Electronics Forum | Tue Sep 09 14:49:13 EDT 2008 | ksrsr
We get our component stencil for this type of rework from Mini-Micro Stencils. We use a Air-Vac rework station and we have no issues at all.
Electronics Forum | Thu Apr 14 09:45:58 EDT 2016 | emeto
Why don't you fix the PCB flatness instead? If that is not the problem, I will check the part warping during the reflow process.If the part is large as you mentioned, it probably warps a lot during reflow. Try to bake the parts in front,based on MSL
Electronics Forum | Thu Apr 14 09:47:46 EDT 2016 | emeto
You can also try different paste from what you are using(may be paste with lower melting point).
Electronics Forum | Mon Apr 25 09:15:18 EDT 2016 | soldertools
Hi Adamjs! Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on to a board or other device. For more details visit us at Soldertools.net
