Electronics Forum | Tue Apr 27 12:32:53 EDT 1999 | Frank Hinojos
What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank
Electronics Forum | Wed Mar 20 15:18:09 EST 2002 | angiewest
You may want to check out IPC-SM-782 "Surface Mount Design and Land Pattern Standard" http://www.ipc.org Good Luck
Electronics Forum | Tue Apr 27 13:00:05 EDT 1999 | Justin Medernach
| What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | Thanks, | | Frank | Frank, Refer to the device manufacturers. they are going to have a recomme
Electronics Forum | Thu Nov 07 10:59:11 EST 2002 | pjc
IPC-7525 "Stencil Design Guidelines" is a good reference document to have. Here are notes from a Tessera, (a major mBGA mfg.), study- "Application Note Solder Stencil Requirement for mBGA" The stencil aperture is to be square, equal in size to the l
Electronics Forum | Sat Dec 15 10:01:59 EST 2001 | davef
USE OF XRAY Xray is not used for testing BGA. Xray is an inspection tool, similar to a microscope. Check the fine SMTnet OnBoard Forum. Gil Zwieg from Glennbrook made some good points. Additionally, search the fine SMTnet Archives, where there�s
Electronics Forum | Wed Apr 28 14:41:45 EDT 1999 | Bob Willis
| | What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | | | Thanks, | | | | Frank | | | Frank, | Refer to the device manufacturers. they are going t
Electronics Forum | Fri Dec 14 08:31:51 EST 2001 | PeteC
For a reference check out IPC-SM-782A Amendment 2 "Surface Mount Design and Land Pattern Standard" BGA. It can be found at http://www.ipc.org
Electronics Forum | Sat Jul 31 13:35:14 EDT 1999 | Miguel Mariscal
| Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | If you know what component your'e going to u
Electronics Forum | Sat Sep 19 16:15:27 EDT 2009 | sskeels
I am looking for a forum to ask for leads (other forums or manufacturers) who might provide what are called IC Adapters or Carriers which allow the use of an IC with a changed footprint (land pattern or pin-out) to be used on a previous PCB which has
Electronics Forum | Thu Oct 14 17:14:39 EDT 2004 | mattkehoe
We are experiencing a problem with soldermask defined BGA pads not accepting solder during the reflow process. The paste is there when the boards come off the printer but after reflow, no paste. Some other pads in the same pattern are fine. Here is t
