Electronics Forum | Thu Mar 03 09:29:12 EST 2005 | jdengler
This sounds like you are using a straight ramp profile. For this type of an assembly you may need to use a soak type profile. Most solder paste providers show you both types of profiles that work best with that paste. I would try using that profil
Electronics Forum | Thu Mar 03 10:59:37 EST 2005 | Rob
Also try boosting the bottom zones up to get extra heat in. Now try this at lead free temperatures & watch them go pop as the air inside expands & vents at the base. O to be in America & be free of our wonderful european decision makers.
Electronics Forum | Thu Mar 03 08:42:07 EST 2005 | cyber_wolf
I just ran into a reflow profiling problem with a new assembly that we are processing in SMT. There is a cluster of six or so electrolytic caps that measure approx. .710" wide by .660" tall. They are spaced .100" or so apart. When I run a profile, t
Electronics Forum | Thu Mar 03 09:11:25 EST 2005 | russ
I wouldn't raise the temps just slow the conveyor, You need to get the PCB "soaked in". It seems as if you are applying more thermal energy than the PCB can accept in all areas. Does this oven have convection heating? Hopefully so. I have found t
Electronics Forum | Fri Mar 21 09:08:53 EST 2003 | mantis
Hi all, I have a strange problem,while building a large 15x15inch 3.5mm thick Pcb.During topside reflow i am experiencing some misaligned parts and even bridging on a bga that are sitting very close to a D size tantalum cap.The strange thing is that
Electronics Forum | Thu Aug 10 05:53:10 EDT 2000 | pascal MATHIEU
hello everybody , i am looking for the elementary caution you need to take when you reflow large board with several thousands of smt components . thank you for your advise
Electronics Forum | Mon Dec 02 21:32:34 EST 2002 | davef
Sounds like you're killing the poor little critters. Tell us about: * Placement force. * Reflow method. * Where and how you are measuring your reflow recipe. * Cooling rate of the reflow recipe. * How the solder connection to the metalization appear
Electronics Forum | Tue Dec 03 10:21:11 EST 2002 | jimlew
I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. Here's the answers to your questions: Placement Force: 0201s are placed on the Siemens S23s with 1 newton of force. The s
Electronics Forum | Mon Dec 02 16:25:06 EST 2002 | jimlew
In doing process qualifications for 0201 caps, has anyone taken cross-sections and discovered cracks / hairline fractures / voids between the metalization on the end and the ceramic itself? (not cracks in the solder joint) We are well within the cap
Electronics Forum | Tue Dec 03 20:54:57 EST 2002 | davef
Q1:A picture of the sectioned MLCC would be nice. A1: I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. R1: You�re correct. You cannot post pix on SMTnet. Please email me t
