Electronics Forum | Wed May 13 10:34:57 EDT 2015 | squeekypigeon
If memory serves me right, if you are test picking a component which will be served to the machine via an LCS the 'pick position' will automatically set itself to feeder slot 1. If you change this to something more central (I used to use location 4
Electronics Forum | Wed May 13 12:39:25 EDT 2015 | arbpkevin
Ahh, yes. Just about the same time you replied someone else I asked said the same thing! I didn't realize that you had to put the part on by hand for the vision test. In the book it says to leave the feeder position set to the default setting. Fu
Electronics Forum | Wed May 06 20:52:26 EDT 2015 | arbpkevin
I have been using my topaz X for about 4 years now and I feel that I am fairly knowledgeable about it, at least the functions of it that I use... I am trying to use the LCS to place some qfp chips on a new product and I have set the whole thing up t
Electronics Forum | Thu Jun 15 07:20:23 EDT 2006 | William G.
How are your experiences with stencilling 0201 components on large circuit boards, i.e. 400 * 250 mm ? Will there not be too much mismatch between between stencil and (FR4) boards? If so, would dispensing be a solution? Any other solutions?
Electronics Forum | Wed Jan 14 17:21:04 EST 2009 | davef
We love Loctite 3609 as a chip bonder, but would never consider it to secure large components
Electronics Forum | Wed Jan 14 17:07:46 EST 2009 | davef
In BIG-boy, high vibration applications to secure large components, we've used 3M #2214 structural adhesive [One part, 250*F (121*C) curing 100% solids, paste consistency epoxy adhesives designed for bonding metals and many high temperature plastics
Electronics Forum | Thu Aug 10 05:53:10 EDT 2000 | pascal MATHIEU
hello everybody , i am looking for the elementary caution you need to take when you reflow large board with several thousands of smt components . thank you for your advise
Electronics Forum | Wed Jan 14 13:38:38 EST 2009 | vleasher
I am attempting to identify a good epoxy to hold on larger parts on thru the reflow process for the opposite side. We currently dispense epoxy prior to second reflow on the corners of the component because the epoxy we use cures before reflow and doe
Electronics Forum | Mon Mar 22 00:17:41 EST 2004 | D. Sanders
Alan, Fuji also has a standard motor feeder FMB-44 that should handle this component (believe the depth is right at 17mm for the feeder). This is the motorized feeder, not the old mechanical ones that they use to sell. D.
Electronics Forum | Wed Jan 14 16:52:40 EST 2009 | vleasher
We currently use Epibond 7275 and it cures way too quickly to allow the component to settle down on the board. Have you used the Loctite 3609 in the application i'm speaking of with success?
