Electronics Forum | Fri Nov 17 07:58:06 EST 2006 | markb
SWAG - I also forgot to mention a few things. Our delmaination was always between the large copper plane and the laminate. It is a multi-layered board, so even when the delamination appeared around components (through visual inspection), cross-sect
Electronics Forum | Thu Nov 16 11:45:15 EST 2006 | markb
I still think the best bet is probably an SMT pre-bake operation to ensure that there is no moisture in the board. Vapor pressure is usually the leading cause for delamination, so removing the source should significantly help out. Unfortuantely, pr
Electronics Forum | Fri Jun 01 16:13:45 EDT 2012 | kahrpr
You also need to get with the PCB manufacturer. Their is a lot that can go wrong with that many layers. If the manufacture is trapping that much moisture. you may have a hard time baking it out. Dave and Graham are right about the time and energy. It
Electronics Forum | Thu Feb 13 19:08:31 EST 2014 | darby
Have to agree with Sr Tech and Spoilt - you'd have to really mistreat your paste these days for it to be the root cause. However, try another paste to eliminate that; making sure you abide by the suppliers specs. Pad design, stencil design,(includin
Electronics Forum | Tue Jan 21 13:51:19 EST 2014 | rgduval
Armando, Is the problem in the same spot on the board with every run? If so, there might be something about that particular location that is part of the cause (ie. ground or power plane connection). It sounds like you're seeing blow holes, or insu
Electronics Forum | Thu Jun 04 09:25:21 EDT 1998 | Chrys
| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo
Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef
Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner
Electronics Forum | Wed Mar 01 02:10:05 EST 2017 | soldertraining
Hi! I am Bob and pls forgive me if technical words I use are wrong. What may cause the BGA solder pad lift before or after reball? I am having problems where solder pad lifted during removal of bad solder ball. It also occurred during reball, where t
Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele
I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar
Electronics Forum | Wed Jun 03 21:40:38 EDT 1998 | Dave F
| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints
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