Electronics Forum | Mon Jun 21 18:15:05 EDT 1999 | George Forrest
We have a need to add a trace to a large quantity of bare PB's. The trace goes from a 25 mil QFP pad to a via. The rework must be done before we process the board. The rework cannot interfere with the solder paste screening process. Does anyone
Electronics Forum | Mon Jun 21 21:05:47 EDT 1999 | Dave F
| We have a need to add a trace to a large quantity of bare PB's. The trace goes from a 25 mil QFP pad to a via. The rework must be done before we process the board. The rework cannot interfere with the solder paste screening process. | | Does a
Electronics Forum | Tue Jun 22 12:22:34 EDT 1999 | David Spilker
| We have a need to add a trace to a large quantity of bare PB's. The trace goes from a 25 mil QFP pad to a via. The rework must be done before we process the board. The rework cannot interfere with the solder paste screening process. | | Does a
Electronics Forum | Mon Jun 21 18:33:46 EDT 1999 | Deon Nungaray
| We have a need to add a trace to a large quantity of bare PB's. The trace goes from a 25 mil QFP pad to a via. The rework must be done before we process the board. The rework cannot interfere with the solder paste screening process. | | Does a
Electronics Forum | Tue Jun 22 10:05:33 EDT 1999 | Chrys Shea
| | We have a need to add a trace to a large quantity of bare PB's. The trace goes from a 25 mil QFP pad to a via. The rework must be done before we process the board. The rework cannot interfere with the solder paste screening process. | | | |
Electronics Forum | Wed Jul 09 16:01:10 EDT 2003 | russ
Mike, the one pad that is "small" definitely appears to be over etching (It looks like it was supposed to be much larger). What is the dims of this little bugger as compared to the Gerber? i would also tend to believe that there probably is some mask
Electronics Forum | Tue Mar 24 13:21:16 EST 1998 | Earl Moon
| Should I use thermals or direct connects on | vias from BGA pads to power planes. The via is | connected to the BGA pad via a short 8mil trace. Thermals are safest. However, I have had no problems using direct connects provided parameters are capab
Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef
We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.
Electronics Forum | Mon Mar 23 15:41:46 EST 1998 | Stuart Adams
Should I use thermals or direct connects on vias from BGA pads to power planes. The via is connected to the BGA pad via a short 8mil trace.
Electronics Forum | Mon Nov 06 10:29:28 EST 2000 | Dean Stadem
All of the replies have merit. Here is another one. Because the cause of the tombstoning is wetting forces that are imbalanced, and one end wets faster or more readily than the other, the 0402 lifts up on that end easily because of its low mass. Incr
