Electronics Forum | Tue Jan 12 10:28:23 EST 2016 | swag
Very cool - we're looking at 3D, too. I spend so much time designing then tweeking so it can be run on a 3 axis mill. 3D would make it easier! Good to know about laser, too. I always wondered the realities of it.
Electronics Forum | Thu Jul 06 08:16:53 EDT 2017 | claudea2
Hello, I have 3 Quad 4C one with Quad Align and 2 with the older lasers. All 3 machines have a placement offset issue. Every 4 or 5 boards one of the machines has a placement offset of about 10-20mills in one direction. A reset usually brings it back
Electronics Forum | Thu Sep 02 07:22:03 EDT 1999 | Earl Moon
| I'd like to know the advantages and disadvantages between the two. | | Thanks and regards, | | Both have their place. When using less fine pitch (.025" +) with fine pitch (.020" or less and BGA's) a .007" thick stencil may be used. This would re
Electronics Forum | Thu Feb 11 09:45:06 EST 1999 | Dave F
| | | Helo, | | Is it common for actual print height of solder paste to exceed the stencil thickness. For example If the stencil is 6mill thick and the actual height of the print is apx. 10 or 11mill. What causes the paste height to be greater t
Electronics Forum | Wed Sep 20 06:01:20 EDT 2006 | bobpan
Sounds to me like your nozzle isnt seating on the z-rod bellows. Pick a nozzle up by do a 'runstep nozzle'.....then do a function 30 ( i hope thats the function because its been YEARS since i worked on a c'series). It should give you a nozzle height
Electronics Forum | Thu Sep 23 12:47:48 EDT 1999 | Earl Moon
| | | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | | The stencil is 6 mil thick, laser cut and electo-polished. | | | The apertures are 12 mil in diameter with 20 mil pitch.
Electronics Forum | Thu Jun 24 13:12:15 EDT 1999 | MD Cox
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Thu Jun 24 15:44:12 EDT 1999 | Earl Moon
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
Electronics Forum | Fri Feb 19 13:54:22 EST 1999 | Tuffty
| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with
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