Electronics Forum: laser optimal 2300 (Page 1 of 2)

Underscreen cleaning cycles

Electronics Forum | Thu May 17 09:01:01 EDT 2012 | scottp

I'm not sure why anyone would pay extra for FG (fine grain) stencils. I've run studies comparing traditional YAG laser, fiber laser, and E-form stencils with regular stainless, FG, and nickel foils. YAG is the worse and should only be used for pret

Vision settings for LED - JUKI KE3020

Electronics Forum | Wed Oct 02 13:54:39 EDT 2019 | fundomikey

Hello, I have a problem with settings vision for LED (similar to this one: https://www.lumex.com/news/SML-LXIL0603-narrow-beam.html) on JUKI KE3020. The LED is mounted on the side. At the beginning I would like to say that laser recognition is impos

Re: Electropolishing Laser-Cut Stencils

Electronics Forum | Tue Jul 14 10:23:42 EDT 1998 | justin medernach

| Hi all, | We are currently having problems with a laser-cut stencil that is | electropolished and nickel plated with 9-mil openings. The paste does | not release well from the apertures. We are having to wipe after every | print. The board is fixtu

Print Parameters

Electronics Forum | Tue Sep 18 12:05:08 EDT 2001 | jschake

Optimal Print Parameters: I have responded to a similar question in the thread titled �Stencil Printing For 0201 Applications�, posted by markt and will refer you to that for addressing this question. If you seek clarification on any of those point

Omron AOI

Electronics Forum | Sat Dec 04 10:21:39 EST 2010 | doremi

Hi, I work with Omron AOI for almost 5 years. Sorry for the late reply, but I visit this site very seldom Basically Omron are considered as the best in solder joint inspection because it used patented 3 colour highlight principle and in 99% the missi

IPC-9850

Electronics Forum | Thu Mar 06 16:34:54 EST 2003 | msivigny

Hello gregp, IPC released 9850 on October 22, 2002 after the industry came together to standardize a method to determine placement capability as it relates to placement speed. As I'm sure you are aware, the standard gives placement machine manufactur

Re: Capability Study for Solder Printing Process

Electronics Forum | Tue Jan 23 22:38:43 EST 2001 | rpereira

I have recently completed a HUGE screen-printing DOE. I used Taguchi methodology and man I got good results! Here is what I learned for what it's worth: (p.s. to the MPM apps guy I sent a copy to Tim Gillis, Lou Fuda, etc...) EFab vs. Laser: EFab

Which AOI /SPI System is the Best? Viscom S3088; Koh Young 8030 or Parmi Xceed

Electronics Forum | Mon Jan 25 14:26:38 EST 2016 | stevea

You are correct about KY having the lions share of 3D AOI in the industry. They were 2-3 years ahead of everyone else to entry, but the gap is closing quickly as the overall capability of KY does not justify their higher price. On the SPI front, Cyb

Iscan 3D Measurement

Electronics Forum | Wed Oct 09 08:36:44 EDT 2002 | pjc

Operation features of many devices, machine components, instruments depend substantially on state of their surfaces. Selective surface processing by high-intensity energy beam (ion, electron, laser treatment) is one of the most perspective directions

Re: SPC on stencil printer/ what's important?

Electronics Forum | Tue Jan 12 21:42:33 EST 1999 | Jon Medernach

What's important in stencil printing (which differs from screen printing) is providing a consistant volume of paste at each interconnect. The process window varies in proportion to the pitch. More than 60% of all defects are related to solder depos

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