Electronics Forum | Fri May 14 16:49:17 EDT 2021 | winston_one
Agree with WiIIR and also can recommend to play with vaccum pump RPM . Slower vacuum increasing have help me to resolve one problem caused by the vacuum (it was solder splash from BGA balls, but the reason can be similar to your case). Also check i
Electronics Forum | Wed Apr 20 10:28:34 EDT 2005 | James
Anyone know of a place to get the vacuum pads for the traverser of the LCS units? Assembleon want over $100 each for a ring of ESD foam! ! ! ! If I can't find a reasonable source I guess I will try to make them myself. James jseagle@zworld.com
Electronics Forum | Wed Apr 20 13:47:58 EDT 2005 | KEN
...those are ESD foam rings. ....and their $107 each. ...and I'm in the wrong business. How many a month do you use?
Electronics Forum | Thu Apr 28 11:27:26 EDT 2005 | James
Just refreshing the topic so it doesn't disappear into oblivion. I am still looking for help with this issue. HELP ! ! ! ! ! Thanks James jseagle@zworld.com
Electronics Forum | Thu Apr 08 07:01:51 EDT 2010 | muarty
Hi, Looking for views and some opinions on the best systems to use to clean pads (particularly BGA) prior to carrying out replacement of parts. I'm thinking of vacuum type desoldering systems. Obviously braid is an option which we currently use, but
Electronics Forum | Mon May 06 06:22:39 EDT 2019 | SMTA-Rogers
Hello! Do you have a better stencil design to reduce the large area of solder joint voids? Or is there a suggested way to set the reflow profile? Or are there other process improvements to make the solder joint at the LED pad less than 10% per void?
Electronics Forum | Tue May 07 10:36:38 EDT 2019 | slthomas
Probably just means you started out with an optimal profile. I suspect that not everyone does. ;) It seems like we did have some luck with profile adjustments in one instance with some QFN's with a large thermal pad. Like I said, though, the profi
Electronics Forum | Thu Apr 28 12:00:15 EDT 2005 | pr
You might try..... http://www.wpsales.com/ or SMT research They sell aftermarket nozzles etc. and if you show them a market for these Vac. pads I bet they would start carrying them (they may have them already). I'm sure there are others out there b
Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
Electronics Forum | Thu May 30 09:33:15 EDT 2019 | emeto
Contributors in order of importance: 1. PCB design - if you have large thermal pads, a grid of via holes should be created. Components with low profile will not let the gas to escape from the joint. The only way is going down. 2. Reduce paste volum
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