Electronics Forum | Fri Dec 17 15:11:34 EST 1999 | Alvin Kevichusa
Let's look at it this way... Imagine a multileaded component sitting on a flat surface. If all the leads touch the flat surface, they are all in the same plane (that of the flat surface) and are coplanar. Coplanarity is desirable because if a lead is
Electronics Forum | Fri Oct 01 17:59:13 EDT 2010 | rway
Your real problem is further upstream. The limitations of your AOI aside, first find out why your leads are being lifted. Is it through handling or are they from the reel that way? To address your AOI question, Hegemon is correct, coplanarity inspe
Electronics Forum | Sat Oct 25 18:46:39 EDT 2003 | Gabriele
JEDEC Standards allows max 4 mils lead coplanarity Gabe
Electronics Forum | Fri Jul 22 10:54:21 EDT 2005 | chunks
I believe it would be easier to place and reflow the parts and then send them out for proper soldering.
Electronics Forum | Wed Jul 27 11:12:15 EDT 2005 | David rRbbie
Thanks for this info', it really helps I will call these guy's ASAP. Cheers, Dave.
Electronics Forum | Fri Jul 22 07:37:32 EDT 2005 | David Robbie
Hi, I am an engineer based in Scotland, but have some IC's sitting with a company in the Boston area, that need checked for coplanarity. Does anybody know of a company/ lab with a lead inspection machine that they could be sent to? Regards, Dave.
Electronics Forum | Fri Feb 11 13:36:40 EST 2000 | Finepitch Services
Jeff, I guess my experience in such issues always took me back to the screen printing process and I only want to bring up that portion of the possible causes to this case. When we talk about coplanarity, the component lead coplanarity first comes t
Electronics Forum | Fri Jul 22 09:23:13 EDT 2005 | alandra516
There is a company in Austin Tx called Process Sciences that can do that service for you. They can be reached at 512-259-7070
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Electronics Forum | Mon Jun 05 10:32:39 EDT 2000 | Khalid Saeed
It could be a gold finish problem. The recommened gold finish thickness is less than five micro inches. Gold thickness greater than five microi inches is significant contributor for causing embrittlement of the solder joints. Verify the reflow profil
