Electronics Forum | Mon Mar 05 17:54:07 EST 2012 | swag
Three ideas for you: 1) Make sure nozzle tips are clean. 2) Check coplanarity of leads to bottom of body. If leads are above body, it could be the are not contacting paste well. 3) Investigate static charge in the parts caused by the feeder or
Electronics Forum | Mon Sep 25 17:06:36 EDT 2000 | JAX
LarryK, You might want to talk with: Fancort Industries, Booth #2630 31 Fairfield Place West Caldwell, NJ 07006 973-575-0610 www.fancort.com MLCS-1 Manual Lead Conditioning System. It is a bench top, hand operated machine to correct deformed lea
Electronics Forum | Tue Feb 08 03:14:37 EST 2000 | Roni H.
Hi Jose, J-lead are very sesitive to coplanarity, which is the major cause for the defect you described. Other posibility is that there is not enough solder paste ; J-lead need around 10% more solder past then L-lead, You have to consider the screen
Electronics Forum | Thu Aug 17 05:56:39 EDT 2000 | Jacqueline
Hi Folks, Hope yous can help. I'm having a problem when reworking (placing) 40mil BGAs. One side seems to be collapsing more so that the other, resulting in the outer row of balls not properly reflowing and making the connection. This is only happeni
Electronics Forum | Wed Mar 15 11:27:05 EST 2006 | stepheniii
By any chance is it eutectic paste and pallidium leads? Also how tight are you checking coplanarity? At least with the MPA-G3 you can check so tight that any IC will fail in the real world. Or you can check so loose that you might as well not check.
Electronics Forum | Wed Dec 01 01:15:44 EST 1999 | Jeff Skeith
dave, you are right on. a blow torch isn't needed to light a fire. a small coplanar aluminum block works extremely well. my dept fixes thousands of fine pitch parts to to less than 4 mils from low lead to high lead every month. all we use is a sm
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Fri Feb 19 09:14:52 EST 1999 | Justin Medernach
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Thu May 10 02:58:00 EDT 2018 | robl
Hi Dex, We're going back a few decades here, but... 1) can you treat it as 4 large leads - one rectangular block per side? 2) Is it failing on the coplanarity check set up or the basic vision? if Coplanarity, can you skip that check? 3) are you us
Electronics Forum | Wed Jan 14 10:07:38 EST 2004 | Patrick
More on QFP soldering issue as per Paul f original e-mail. 1. Problems occured on different PCB's, on different lines using different equipment 2. Flux residue is common in the dimple on the solder. 3. The fault occurred using both "Kester 265" & "Al
