Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Tue Jul 06 09:35:45 EDT 2010 | rgduval
Sean, We can't comment on the EDX report; but, we have seen these types of problems before. We would initially agree with you that it seems like a material issue. A solderability test should be performed on the part, and on the board. Easist way
Electronics Forum | Mon May 07 09:47:45 EDT 2001 | orbotech
An ultimate truth in AOI is that "you can not avoid what you can not see". At the post solder stage, 2D inspection is typically not enough as it simply "can not see" everything using a single perspective, and therefore, can not detect all of the faul
Electronics Forum | Fri Oct 24 13:51:27 EDT 2003 | stefwitt
We usually matched the value with the thickness of the paste or stencil. If the lead doesn�t dip into the paste it will not be soldered.
Electronics Forum | Thu Feb 10 04:07:29 EST 2000 | Wolfgang Busko
Jeff: We had a similar problem a couple of years ago with boards from one specific subcon. At first sight the joints looked well formed sometimes with a little bit more sometimes with a little bit less solder but still in limits not to be worried abo
Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F
Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan
Electronics Forum | Tue May 05 15:45:37 EDT 1998 | Dave F
| Looking to buy used or new tubes, that will fit an SOIC-16 | Need these tubes ASAP. We need to bake these parts and drypack. | Please email or call if you can help. | Eric Jenkins | 801 956-0897 Eric I'm not sure of the manufacturer of the parts th
Electronics Forum | Fri Mar 18 14:32:43 EST 2005 | pmd
Im not fimiluar with SIEMENS F5 but I believe that lead length devations translate to coplnary devations. As a lead gets bent inward or outward the coplnary changes. I dont know what the ratio is but you may be able to set tolorances for lead length
Electronics Forum | Mon Aug 24 18:34:31 EDT 1998 | Steve Evers
| Any competition for Teradyne on this front? Any users out there with comments? | Thanks in advance. | G If your new to the world of Fying Probe ICT you may think this is a new developement. Its not, this technology has been around for 10+ years. M
Electronics Forum | Wed May 17 13:07:09 EDT 2006 | Chunks
I would suspect touch-up/repair, unless all your caps are falling off. I know our operators use two irons to solder both sides at the same time. If it's not flay and square, yo may get the defect you are talking about. Another area is co-planari
