Electronics Forum | Wed Oct 01 13:39:13 EDT 2003 | arturoflores
They take the solder in a dip and look solderability test but when in normal reflow process we got some pins that do not get wet and the appearance is as follows: -Pillow effect on the toe(no front fillet is formed) -There is a sheet of flux between
Electronics Forum | Mon Feb 25 18:10:13 EST 2002 | stepheno
When you say "dropping" I assume you mean "rejecting" them because co-planarity is outside the tolerance you have set and the machine is putting them on the reject belt or tray as the case may be. I worked for a CM with an MPA-G3. One customer suppl
Electronics Forum | Fri Sep 05 15:10:18 EDT 2008 | tony_d
Hello Federico, I know what you are going through. A few years back, I was faced with having to purchase AOI equipment for my business. My selection team and I looked at several different manufacturers including MVP (too difficult to program!). We
Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon
You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to
Electronics Forum | Tue Apr 20 23:18:48 EDT 1999 | KEVIN SIMPSON
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Wed Oct 27 07:38:08 EDT 1999 | Mario
Hi Jerry, I have a solution for you which I have done myself and shown to others which should cost you less than 100$ if you already have a microscope.This is still an operator job and an automated operation. You need two mirror squares (about 4inc
Electronics Forum | Sun Apr 18 03:58:26 EDT 1999 | P.L. Sorenson - Technical Consultant
| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | To remove moisture from low quanti
Electronics Forum | Tue Feb 18 16:31:43 EST 2003 | arturoflores
Haran: Have you made improvements regarding your BGA shorts? We are facing the same problem and we think it is partly because the non coplanarity of the seating plane of the BGA which causes BGA balls to squeeze on one side of the BGA. Also, we ha
Electronics Forum | Thu Sep 07 07:41:06 EDT 2006 | Bubba
Check for coplaner leads if this just exists at reflow process, i.e. look at part before oven, turn on 3D at placement machine. If you see after wave solder, the wave could cause coplanarity issues on top as well if you are going slow enough to refl
Electronics Forum | Tue Mar 27 06:37:14 EDT 2007 | realchunks
There is no "standard" or "procedure". Your customer is putting a requirement on you because this has probably lead to weak QFP solder joints breaking in the field or non-functioning units due to co-planar QFP legs. I�ve been there done that. Had
