Electronics Forum | Thu Apr 15 11:56:42 EDT 2004 | patrickbruneel
I would try a PTFE (Teflon) wire or Teflon protected wire or you could try anodized aluminum. Its getting more and more interesting how the lead free era develops. Just a thought I wander how long its going to take the tin (not passivated with lead)
Electronics Forum | Mon Oct 18 22:15:11 EDT 2004 | KEN
I have two industry leading customers that have specific requirements for components to survive 30 seconds above 230C. In one case I have a custom ASIC that is heat sinked on the die (to the PCB). The sink pulls heat out of the lead frame very effi
Electronics Forum | Mon Jul 24 11:35:42 EDT 2006 | Jimk@ics-inc.org
We have experienced a problem with tin leaching or discoloration of lead terminals on random parts on solder side of a paste/paste operation. The profile has been used on previous production runs and there doesn't appear to be any heat damage to othe
Electronics Forum | Thu Mar 01 11:47:20 EST 2007 | Wagoner
Run the lead free BGA side first. Then run the tin lead side second. We do this on some boards so that we don't overheat the components on the second side. There is no reason that the lead free solder needs to reflow on the second pass.
Electronics Forum | Thu Mar 09 16:29:35 EST 2006 | russ
Will the Pb part handle 240C? That is the first question that you need to answer. If it will then yes I would run the pbfree paste and profile. I assume that all other components are pbfree. If not, the same questions will need be asked as for th
Electronics Forum | Mon Jan 25 13:42:35 EST 2010 | patrickbruneel
This is a post from another forum as a response from Bob Landman to a claim that he had no evidence to be concerned about lead-free in hirel applications (interesting read). See below and am sure many technetters will find this interesting **********
Electronics Forum | Thu May 01 13:58:31 EDT 2008 | mmjm_1099
In our house we have had some of our BGA's reballed because it was a lead-free part and wanted to place on a leaded assembly. Hope this helps.
Electronics Forum | Thu May 01 15:11:37 EDT 2008 | dphilbrick
CK So as I see it batch B represents a leaded process with leaded components and D is a leaded process with lead free components. Batch Components Paste B SnPb Sn62 D Lead-free Sn62 If so it is BETTER to run a lead free BGA with Sn
Electronics Forum | Thu May 01 21:17:38 EDT 2008 | davef
The concern about lead contamination of lead-free solder has to with zone refining. For more, look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=30315
Electronics Forum | Thu May 01 15:42:53 EDT 2008 | ck_the_flip
Yes, the authors do give the caveat that small amount of lead contamination in a SAC/Lead-Free system is tolerated provided the Pb-BGA has sufficiently reflowed. This verbiage is on the bottom of Figure 10. For my own peace-of-mind, I would send yo
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