Electronics Forum | Wed Dec 22 07:20:21 EST 2010 | piter
HI I used both of solder leveling HASL and ENIG, HASL I can recommended for biger pitch is cheaper solder leveling than ENIG but problem with that solder leveling is during the reflow process HASL isn't flat and during reflow process component move
Electronics Forum | Wed Dec 22 01:39:06 EST 2010 | boardhouse
Hi Johan, As a Asian board supplier - I would not recommend using Lead free hasl on any product that has BGA, you would be just looking for issues, flatness being the main. I agree with one of the other replies - Your purchasing dept. should not be
Electronics Forum | Thu Dec 01 00:34:15 EST 2005 | pyramus
Guy's another question, how about any recommendation what type of adhesive to use as underfill for BGA during lead free process? Currently, we are only using Loctite 3609 & 3515 as adhesive we use 3515 as BGA underfill during normal leaded process s
Electronics Forum | Wed Jun 16 11:27:06 EDT 2004 | larryk
If you did not increase your heat to melt the lead free BGA balls, I would be very concerned.
Electronics Forum | Sun Jun 13 07:57:15 EDT 2004 | Grant
Hi, We have been offered some lead free BGA parts in place of normal lead solder BGA parts in our process, and because we can get them faster it would be a good option. However does anyone know if we can use them as normal. I assume the balls won't
Electronics Forum | Fri Jun 18 20:29:39 EDT 2004 | Ken
The problem is lead enrichment regions forming in the hottest part of the joint. The lead pool is the weakest part of the (SMT) joint. In TH interconnects hot tear or pad lift can result. I have recently seen this first hand.
Electronics Forum | Fri Jun 18 14:33:53 EDT 2004 | timo
Shouldn't be a problem. The issue is when we go to Pb-Free pastes with Pb-bearing components.
Electronics Forum | Sun Jun 13 08:01:50 EDT 2004 | Grant
Hi, Oops, looks as though this has already been covered in another thread. However it was not clear if anyone's done this, and if it worked ok. We only need to do a few hundred boards. Regards, Grant
Electronics Forum | Sun Jun 13 18:44:54 EDT 2004 | Ken
If the balls are SAC then you may actually reflow them at 217C. Of course, I may be assuming they are SAC...
Electronics Forum | Mon Jun 14 14:53:43 EDT 2004 | russ
Yes you can, we have done it for years. Russ
