Electronics Forum | Thu Oct 12 09:22:12 EDT 2006 | charless
Hi We are experiencing different failure modes between leaded and lead free through hole assemblies. The boards are PTH. In the case of lead free boards we are seeing fracturing of the component legs much earlier than we do with leaded assemblies. N
Electronics Forum | Mon Oct 16 15:46:24 EDT 2006 | slthomas
The wording in your second post re: lead vs. lead free behavior seems to contradict your first post, but I'll assume you mean that the lead free boards fail sooner during vib. testing. My question is, if this is the case, are the parts that are fai
Electronics Forum | Fri Oct 13 03:29:46 EDT 2006 | AR
Hi Could you specify what you mean by fracturing component legs?
Electronics Forum | Mon Oct 16 11:25:11 EDT 2006 | charless
Yes of course. The leg of the component breaks between the top of the solder joint and the component body. We can induce the same failure mode with lead free joints but usually after 10x longer on vibration.
Electronics Forum | Tue Oct 17 03:13:10 EDT 2006 | charless
Apoligies Steve if I did not explain myself clearly. We have made the same design using the same RoHs compliant components (which I am assured by the suppliers are process temperature capable) with both lead and lead free solder. Without wishing to
Electronics Forum | Thu Feb 05 08:39:16 EST 2004 | davef
IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards, Table 9-3 � Plated Through Hole Diameter To Lead Diameter Relationships will give you the standard information you require.
Electronics Forum | Thu Jan 29 00:12:39 EST 2009 | grayman
Hi Armando, I think you have to buy a bigger reflow let say 7 zones to get the correct profile. The reason you are getting that problem is due to short profile time. What is the size of your board? What is the composition of your solder paste? Ple
Electronics Forum | Fri Jul 27 10:07:18 EDT 2007 | rgduval
Our preference has been ENIG. We find that we achieve higher quality (visually) soldering for through hole and surface mount parts, with less handling issues than when we use white-tin, or immersion tin. We are about to do a test on some boards tha
Electronics Forum | Mon Jun 14 11:00:50 EDT 2004 | raylawre
This is one reason why we changed package styles. Maybe consider getting a different size tube, say from 500g to 1000g or something like that. We use jars for lead paste, and tubes for lead free (different application method) If lead free comes off t
Electronics Forum | Fri Sep 18 09:22:03 EDT 2009 | ysutariya
Don't forget the possibility of excess moisture absorption. If this is lead free, then the laminate manufacturers state that you should bake prior to assembly. Was this completed?
