Electronics Forum | Thu Jan 29 16:48:49 EST 2009 | slthomas
Looks like a time/temperature problem to me. However, there are a lot of solder fines surrounding the pads in one photo that go beyond what I'd expect from inadequate TAL. Is it possible that the board was misprinted and not completely cleaned, or
Electronics Forum | Tue Nov 16 06:52:44 EST 2010 | cacace
1 um". Some PCB manufacturer is telling me that this specification is not feasible in production. I would know if this position is due to the equipment (or process control) they have, or if in effect is not possible to satisfy my requests.
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Thu Jan 29 11:30:56 EST 2009 | rgduval
As others have said, you'll have some difficulties getting good reflow on pb-free out of a 3-zone oven. We did it with a 4-zone for awhile, but only had really good success on low thermal density boards. That said, you should definitely check your
Electronics Forum | Thu Nov 03 09:43:55 EST 2005 | lupo
Check flux penetration and type of flux. How much is solid contents. The solder filling is better under Nitrogen. Check the time (speed) of the nozzle whether is correct. Usually For SAC305 the temperature of bath is 320C/degrees, but only for sel
Electronics Forum | Thu Jan 29 00:12:39 EST 2009 | grayman
Hi Armando, I think you have to buy a bigger reflow let say 7 zones to get the correct profile. The reason you are getting that problem is due to short profile time. What is the size of your board? What is the composition of your solder paste? Ple
Electronics Forum | Mon Feb 02 09:22:55 EST 2009 | ck_the_flip
Everyone's telling you setpoints, but yet, we haven't seen a thermal profile from you. It'd help if you can provide this, and using everyone's recommended setpoints, determine if your profile is meeting: 1.)Time Above Liquidus 2.) Peak 3.) Ramp
Electronics Forum | Wed Nov 17 10:03:29 EST 2010 | scottp
Instead of a minimum thickness, we require no exposed copper or SnCu intermetallic. We've been having a lot of trouble lately with suppliers of SN100 HASL boards giving us pads with very irregular solder deposits with areas of exposed intermetallic.
Electronics Forum | Thu Jan 29 16:51:57 EST 2009 | gregoryyork
Hi Small ovens work fine if the settings are correct and I seriously doubt 55cm/min is right. Profile it and speed down to around 35cm/min. Increase first zone to around 170 keep second at 208 but increase last to around 280 BUT profile to check it
Electronics Forum | Tue Sep 13 08:45:51 EDT 2011 | rgduval
Lead free solder does tend to resemble cold solder joints after processing. Generally, this is acceptable. The latest IPC 610 has pictures of acceptability of lead free solder joints, which you can use to compare to the joints that you are seeing o
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