Electronics Forum | Wed Feb 09 13:25:08 EST 2005 | jdumont
Good day all, I am wondering if there is a company out there that sells kits that contain a board, components and the stencil? When we get our new reflow and wave machines in I will need numerous boards to run and evaluate until I can get the process
Electronics Forum | Mon Sep 17 05:48:10 EDT 2012 | stivais
Hi Ben, Yes, this could be the reason but have you ever seen solderability issues for (new) boards with LF-HAL surface finish? I have seen this only if there are surface finish quality issues for bare boards (exposed copper etc.). In this case we di
Electronics Forum | Tue Feb 27 23:58:49 EST 2007 | KEN
Hmmm.... I had Intel survey my process on a mixed alloy line for 2 days. They periodically removed boards from all stations on the line (including post reflow). Boards were "crushed" and spearated into constituent plastic, ceramic and metals. All
Electronics Forum | Wed Dec 22 07:20:21 EST 2010 | piter
HI I used both of solder leveling HASL and ENIG, HASL I can recommended for biger pitch is cheaper solder leveling than ENIG but problem with that solder leveling is during the reflow process HASL isn't flat and during reflow process component move
Electronics Forum | Tue Feb 27 12:16:19 EST 2007 | wavemasterlarry
hahaha! LISTEN, everyone knows that oven get dirty. They need periodic cleaning. So if you run lead boards thru your oven you will get lead dust and residue in you're oven. If you want to be truely lead free you need to get all the lead outta of
Electronics Forum | Wed Aug 10 10:41:23 EDT 2005 | patrickbruneel
Bob, Great theory if you're selling SN100C, but I have to disagree that an alloy being 4�C off eutectic will cause cracks. When a solder joint exits the solder wave, there is an immediate drop in temperature of 100�C. so being off 4�C is irrelevant.
Electronics Forum | Wed Dec 22 01:39:06 EST 2010 | boardhouse
Hi Johan, As a Asian board supplier - I would not recommend using Lead free hasl on any product that has BGA, you would be just looking for issues, flatness being the main. I agree with one of the other replies - Your purchasing dept. should not be
Electronics Forum | Wed Sep 19 10:27:03 EDT 2012 | davef
My email mail machine couldn't send this to you ... Hi Stivais ... I didn't read the report. It seems to require downloading of a 'reader' of some sort. No thanks. If you would, just attach the report to this email. Regardless, energy-dispersive X-r
Electronics Forum | Thu Dec 01 00:34:15 EST 2005 | pyramus
Guy's another question, how about any recommendation what type of adhesive to use as underfill for BGA during lead free process? Currently, we are only using Loctite 3609 & 3515 as adhesive we use 3515 as BGA underfill during normal leaded process s
Electronics Forum | Thu Nov 30 17:31:41 EST 2000 | Larry C.Dyck
i am looking for info on lead free solder screen printing
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