Electronics Forum | Wed Dec 22 07:20:21 EST 2010 | piter
HI I used both of solder leveling HASL and ENIG, HASL I can recommended for biger pitch is cheaper solder leveling than ENIG but problem with that solder leveling is during the reflow process HASL isn't flat and during reflow process component move
Electronics Forum | Thu Jan 25 13:20:17 EST 2007 | slthomas
Are you running a lead free process? If not, have you identified these as lead free components? If so, have you increased the temps in your profile to accomodate that? After that, I'd look for a AgPd (silver/palladium) or some other such PITA platin
Electronics Forum | Tue Jun 07 19:24:26 EDT 2005 | Joseph
Dear all, Recently we encountered some functionality failure when using lead-free component(Sn99.3/Cu0.7)at SnPb(Sn63Pb37) wave soldering process. Can lead-free component use at non-lead free process? Any input/idea are much appreciated. Rgds
Electronics Forum | Wed Apr 03 19:03:31 EDT 2013 | hegemon
In agreement, in that you should have already printed enough paste on the board to accomodate the joint. Adding paste would give the result you described. (too much solder) Adding a little flux (only) and heat would be the correct path out of that s
Electronics Forum | Wed Nov 19 16:35:27 EST 2003 | davef
We'd be incluned to dip the BGA ball in tacky flux, place the BGA on the PTH interposer, reflow that suka, and get on with things. [Take the people involved out to lunch with the money you save on not buying a stencil.] On damaging the glop top, we'
Electronics Forum | Tue Feb 01 14:26:34 EST 2005 | rabell
I agree re; "always will be some assemblies that must be repaired". This is unlikely to lessen in the near term with an imminent move toward Lead-free. We are currently working with Cookson, PACE, and BEST developing a course in lead-free rework wh
Electronics Forum | Thu Jun 09 06:15:17 EDT 2005 | Clampron
Joseph, We have all been using lead free components for some time. Many passive already have a Pb free plating and we have not seen catastophic failures on them. From the information I have seen, I think this should be OK (with the exception of BGA'
Electronics Forum | Thu Jun 09 05:04:05 EDT 2005 | Joseph
Dear Patrick, Unfortunately we do not know what exactly the failure as our customer refuse to reveal to us. From visual inspection the solder joints are smooth and shiny as per IPC-A-610 requirements. The component supplier (IR) commended that they
Electronics Forum | Sun Dec 19 08:05:14 EST 1999 | Dave F
Clarissa: We've all done thing on a limited basis, especially on prototype boards, but this doesn't sound like a limited basis, or prototype boards. (And may be I reading too much into this, we all know the frailities of conversing like this.) Thi
Electronics Forum | Thu Feb 27 02:55:53 EST 2020 | hexton
I want to avoid peoples preferences as they will differ and will not be a deciding factor. A heat gun will introduce risk to surrounding PTH components and having to add protection for those, will limit any gain in productivity. There is no question
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