Electronics Forum | Thu Jan 19 11:04:08 EST 2006 | Mike Konrad
No, there are no issues with mixed lead / no-lead post-reflow cleaning. No-lead is a little harder to clean so be sure you use the appropriate parameters and cleaning chemical. The only potential issue is if you mix up the boards after cleaning,
Electronics Forum | Mon Mar 25 16:40:17 EDT 2013 | rrpowers
I have a customer that is wanting to use a low-temp solder paste such as SnBi for a lead free circuit, however they are specifying PET for the flex circuit. I have always used polyimide for SMT reflow due to the temperature limitations of polyester.
Electronics Forum | Wed Oct 04 09:55:51 EDT 2006 | borgie
Hi. I have product in lead containing process that consist lead free BGAs and also big ceramic BGAs with high temperature bumbs. Pcb tends to bow in a reflow profile, since I need long preheating times and relatively high peak temperature to melt BG
Electronics Forum | Tue Oct 14 11:34:04 EDT 2003 | Axl
As far as solder paste goes search no further! I have worked for some huge CM's as a Process Engineer and a lot of them have put thousands of hours of Engineering time and evaluation just to come up with the same answer every time. For no-clean it is
Electronics Forum | Thu Jul 05 14:00:37 EDT 2007 | 18424
Are you using a leaded or lead-free process?
Electronics Forum | Thu Jul 05 14:10:46 EDT 2007 | arun2382
Lead-free process.
Electronics Forum | Tue Dec 04 08:34:07 EST 2007 | davef
We no advice to give you on the topic, but maybe while you're waiting for others to reply, reading a trade journal article on the topic might help. Below is a link to "Pin-in-hole reflow (PIHR) and lead-free solder joints" by David Bernard, Bob Willi
Electronics Forum | Fri Jan 18 12:34:14 EST 2013 | duchoang
Yes, I have. think I have pretty good reflow profile. We use Lead-Free,No-Clean,SAC305 Solder Paste. The problem is at LGA design.The pad size is alot bigger than BGA. They are totally flat and do not have balls/spheres which melted and collapsed thr
Electronics Forum | Sun Jul 12 21:07:07 EDT 2009 | padawanlinuxero
I have a problem we change a product from leaded to lead free, I was not involve in the selection of the new reed switch, but now we are having problems with the hermeticity in the switch,this occurs after is overmould and put to a 6 cycles in the th
Electronics Forum | Fri Jan 21 00:51:56 EST 2005 | WDLau
Hi All, could anyone advise me what we need to pay attention to if we will be usingthe Sn Pin plating as lead free requirement in SMT reflow process, is it a need to increase the Temp Profile by 10~15 Degree c as Sn with Melting ppoint 232C, Please
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