Electronics Forum | Thu Nov 03 09:43:55 EST 2005 | lupo
Check flux penetration and type of flux. How much is solid contents. The solder filling is better under Nitrogen. Check the time (speed) of the nozzle whether is correct. Usually For SAC305 the temperature of bath is 320C/degrees, but only for sel
Electronics Forum | Wed Nov 02 12:08:40 EST 2005 | chunks
It could be lack of preheat or flux. You can verify the flux by hand applying. I'll bet it's lack of preheat though. That's usually the case with selective solder.
Electronics Forum | Wed Nov 02 11:25:46 EST 2005 | dougm
I should specify that I am using SAC 305 as well.
Electronics Forum | Wed Nov 02 11:14:45 EST 2005 | Doug
I am doing lead free testing on a Vitronics selective machine with a 4 mm nozzle. The finishes I am testing are ENIG, ImSn, and ImAg. The problem I am encountering is achieving good top side wetting. Has anyone had any luck with this type of an ap
Electronics Forum | Sat Jun 24 07:23:06 EDT 2017 | tch
You will need to preheat the boards for a lead free selective solder process. A preheat module is critical for any wave or selective solder process, if you don't get the board preheated properly the solder is going to resist flowing to the top of the
Electronics Forum | Fri Jun 23 12:54:53 EDT 2017 | guts1872
We are having issues with top fill and dropping pins on Molex connectors with our KISS 101. Unfortunately we do not have a pre heater and bottom side pre heat with our nozzles is not satisfactory. Most of the issues occur when using a no clean proces
Electronics Forum | Fri Jun 23 15:11:11 EDT 2017 | emeto
Try add a pre-heater. If not change the process or the machine. With KISS you will hardly get any PCB to work properly.
Electronics Forum | Thu Jun 29 12:07:09 EDT 2017 | georgetruitt
HOW THICK IS THE BOARD? IS THERE A LOT OF COPPER IN THE BOARD? DOES YOUR CUSTOMERS PROVIDE HEAT RELIEF IN THE BOARDS BARREL DESIGN THERE NEEDS TO BE PLENTY OF ROOM FOR LEADFREE SOLDER TO FLOW, DID YOU CHECK YOUR PIN(LEAD)TO HOLE (BARREL) RATIO? N
Electronics Forum | Thu Apr 27 03:23:25 EDT 2006 | ge_lim
According to seho, for multi dipping the process window is very small and they would prefer drag soldering which has a wider window. What is your view on dip vs drag? Why? Other machine user also share the same suggestion?
Electronics Forum | Wed Apr 26 07:37:34 EDT 2006 | amol_kane
"Can we reuse the same machine? My point here is that the non lead free process has already coated the machine interior ( exhaust, internal flow ) with leaded component, and by conversion to lead free are we containminating the lead free product from
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