Electronics Forum | Mon Jul 20 10:54:37 EDT 1998 | Barbara Giunta
I work for DuPont and we supply engineering thermoplastics to the connector industry. We heard that there's a trend towards lead-free solder paste. Can anybody tell me name of companies that are already using lead-free solder paste in US and Europe?
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Mon Oct 26 15:38:27 EDT 2009 | davef
We believe that some suppliers replace nickel with cobalt in SN100 to product a shinier, less grainy, more attractive lead-free solder connection. SN100E sales-types like the idea that it is available in paste, bar stock, and other forms; as compare
Electronics Forum | Tue Oct 25 15:19:15 EDT 2005 | jimmyjames
Sorry this is such a long thread but I would like as much input as possible to everything I ramble on about... :) ------------------------------------------------------ We are now seeing more and more RoHS parts showing up in our SMT inventory and
Electronics Forum | Mon Dec 30 08:14:45 EST 2013 | jax
I was unaware of any Pb-Free process capable FR-1 laminate... not to mention capable of Though Hole plating that would be expected when wave soldering. What is the Td and Z-expansion for the laminate you are using?
Electronics Forum | Thu Apr 27 03:23:25 EDT 2006 | ge_lim
According to seho, for multi dipping the process window is very small and they would prefer drag soldering which has a wider window. What is your view on dip vs drag? Why? Other machine user also share the same suggestion?
Electronics Forum | Mon Dec 30 02:05:08 EST 2013 | mysmt
Hello, I am facing intermittent delamiantion effect in FR1 type laminate after wavesoldring.Bath temp. is 255 degees cel.Preheater temp is also controlled (110 deg cel. on top side before passing on solder bath). Thanks,
Electronics Forum | Fri Jul 25 23:01:04 EDT 2008 | chip_flip
What paste are using? You should referance the manufactures time and temperature specification. Running lead-free in a 5 zone oven can be done with out a problem but it is not production friendly. If you are concerned with through put I would look fo
Electronics Forum | Wed Jan 01 21:58:31 EST 2014 | mysmt
Hi , Wish you a happy new year. Find attached datasheet of laminate. Thanks,
