Electronics Forum | Thu Oct 31 12:37:37 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Mon Dec 22 12:41:17 EST 2003 | Marc Simmel
No clean solder paste. One further observation ... the parts have a metal shell and are 'floating' high on the paste. Though there is wetting on the metal shell, it doesn't seem to sink as far as it should and this could be lifting the soldertails f
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Fri Dec 12 17:19:08 EST 2003 | davef
Here's two angles to think about. Solder goes to the component and not both the board and the component because: * Component lead is much hotter than the the pad on the board. [This probably doesn't apply in your case, because it doesn't repeat fro
Electronics Forum | Thu Oct 31 17:34:37 EDT 2013 | hegemon
Keep in mind that you may need to assure that there are no pure tin finishes remaining on your parts. A general idea is that parts with pure tin (RoHs) finish will need to be plated with tin-lead solder to avoid the possibility of tin whiskers formi
Electronics Forum | Wed Dec 23 10:25:00 EST 2009 | spitkis2
Is it possible to reflow leaded or lead-free solder paste onto chrome plated pads? Thanks.
Electronics Forum | Thu Nov 10 08:23:35 EST 2005 | arclightzero
Hello, I am currently trying to isolate internal fallout problems with very low yield substrates mixed with great yields and have recently found that we are using a Sn62/Pb36/Ag2 solder paste with full tin (no lead) components as well as Pb95/Sn5 sol
Electronics Forum | Wed Oct 26 10:40:43 EDT 2005 | patrickbruneel
Jimmy, We've been soldering tin plated components and Ni/Sn (100% Tin) boards with leaded solder in the 80's in hirel and military applications. We never experienced reliability issues with the mechanical or electrical properties of the solder joint
Electronics Forum | Mon Dec 22 19:43:43 EST 2003 | Dean
I have seen this affect on Immersion Tin and OSP. 70 to 90 % of the solder wicks to the lead and forms a "single" homogenous solder mass. This even though the pad was 100 % covered with paste... Evaluated different solder paste...did find variatio
Electronics Forum | Wed Apr 08 22:39:12 EDT 2009 | jandon
AIM has very narrow process window on their solder pastes...
