Electronics Forum: lead free solder paste (Page 78 of 326)

Re: high temperature solder alloy

Electronics Forum | Fri Oct 08 08:26:03 EDT 1999 | Carol Zhang

| | | I have a board, 4 spacers needed to be soldered on the board | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, ther

Re: high temperature solder alloy

Electronics Forum | Thu Oct 07 16:57:02 EDT 1999 | Glenn Robertson

| | I have a board, 4 spacers needed to be soldered on the board | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, there wi

SMT line expansion - new oven and selective solder

Electronics Forum | Sat Feb 22 11:37:00 EST 2020 | kylehunter

Hey all, I've made a post in the past about us expanding to a new space, but I wanted to do a new post with specific questions. We currently have a DEK 265, Phillips Opal Xii, and a Heller 1500. Our main reason for expanding is to have a lead-free

Re: High-Temp solder for thermocouples

Electronics Forum | Thu Dec 17 10:22:31 EST 1998 | Earl Moon

| Necessity is the mother of invention... | | The other day I loaned my last bit of high-temp solder to a co-op and never saw it again. Then I had to run a profile and I was in a pickle with no solder. | | So I ran out to the local Radio Shack to

minimum solder ball (bead) size

Electronics Forum | Wed Jun 07 10:56:38 EDT 2006 | Chunks

In the past, I would normally tell out highly talented inspectors to leave the balls there. The were trapped in the flux residue and were hard to remove. Never caused a problem. But then there was an incident where someone had the bright idea to u

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Mon Sep 08 01:45:35 EDT 2008 | rameshr

1.The Temperature on the pad is 247.C & also it is an lead free profile, the same profile we have used till last lot but we had obsereved this problem earlier to this current batch. 2. Both in Type3 & Type 4 paste we are using because of we are using

Re: Void in solder bump

Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.

| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard

Re: high temperature solder alloy

Electronics Forum | Fri Oct 08 10:08:48 EDT 1999 | Glenn Robertson

| | | | I have a board, 4 spacers needed to be soldered on the board | | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first,

Re: Ceramic + Hi-temp solder

Electronics Forum | Thu Apr 22 14:31:39 EDT 1999 | Dave F

Michael: Two things: 1. Profile: A. Your FR4 profile will not produce good solder connections on your ceramic substrate. Hey wait a minute, you soldered FR4 at 250C?? Ceramic is a themal sponge. You'll need to play, but it should be easy compare

Post reflow solder joint inspection

Electronics Forum | Mon Feb 02 22:01:24 EST 2004 | Dean

I find this disturbing when customers dictate your process and equipment? Your responsibility is to deliver a quality product on time. Why would your customer care HOW you achieve this? Hence the success of Chinese manufacturing. I have one custo


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